ISSN 2380-4505
Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Hermetic Sealing of Stainless Steel Packages by Seam Seal Welding
Hermetic Sealing of Stainless Steel Packages by Seam Seal Welding
Articles in Vol. 2010, Issue 1, 2010
Vol. 2010, Issue 1, 2010
- Wafer-Level hermetic packaging for bio-medical applicationsAntonio La MannaCarine GeretsMaaike Op de BeeckThibault BuissonEric DyPhilippe Soussan
- Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip ChipDo-Jae YooKi-Chan KimYoung-Hoon KwakMin-Seok JangJob HaJae-Cheon DohChang-Bae LeeYoung-Do Kweon
- Pinout Optimization for 10 Gbps+ Serial Link RoutingDavid SiadatJudy Priest
- The reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module ApplicationChang-Bae LeeJin-Gu KimYoung-Do KweonKyoung-Moo HarrYoung-Ho Kim
- Counterfeit Detection Strategies: When to Do It / How to Do ItGreg Caswell
- Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS TechnologyZhongping BaoJames Burrell
- Wafer Level Package with Y shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS ResonatorYuhan CaoLe Luo
- The Role of Wafer Bonding in 3D Integration and PackagingJames HermanowskiGreg George
- Compression Molding for Thin PoP Top PackagesRavikumar AdimulaJason BrandMyung Jin YimJames ZhangRichard StrodeChan Yoo
- Development on Silicon module with Cu-filled TSV and Integrated Passive DevicesYun-Mook ParkJun-Kyu LeeByung-Jin ParkByeung-Gee KimJung-Won LeeIn-Soo Kang
- Fine Pitch 3D Dispensable Electrical Interconnects for System In Package SolutionsJeff S. LealSuzette K. PangrleCharles WhyteKeith BarrieJeff LeffScott McGrathGerardo Ayala
- Evaluation of Glass Frits for Development of Lead-Free Thick Film ResistorXudong ChenW. Kinzy Jones
- Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen InksS. FarnsworthI. RawsonK. A. SchroderD. Pope
- Fast and Accurate Multi-Layer PDN Analysis for Power Integrity and EMCBruce ArchambeaultKetan ShringarpureJun FanSam Connor
- Fine Pitch Cu Wire Bonding – As Good As GoldBernd K. AppeltWilliam T. ChenAndy TsengYi-Shao Lai
- Thermosonic Gold to Gold Intermetallic Advantages for CSP PackagingPhilip Couts
- Advances in Wafer Level Processing and Integration for CIS Module ManufacturingBioh KimThorsten MatthiasGerald KreindlViorel DragoiMarkus WimplingerPaul Lindner
- Imminent Needs in Future Development of Air Cooled Microprocessors Heat SinksV. GanescuA. Pascu
- Sensor Packaging: New Challenges for New ApplicationsCaroline Beelen-HendrikxCoen Tak
- Enabling MSL-1 Capability for QFN and Other Design Leadframe PackagesDan HartJohn GanjeiNilesh Kapadia
- A study of high Cu behavior on electrolytic Ni and electroless Ni pad finishHyun-Kyu LeeYong-Chul ChuMyung-Ho ChunSang-Ho Jeon
- Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D PackagingKoushik RamachandranFuhan LiuNitesh KumbhatBaik-Woo LeeVenky SundaramRao TummalaMark Wilson
- Custom Test Fixture Design and Measurement Correlation of Differential Pairs in a Flip-Chip Organic Buildup Package Using Measurement Based De-embeddingDaniel LambalotSanjeev Gupta
- Capacitance Calculation for Offset Via Structures Using an Integral Approximation Approach Based on Finite Element MethodHanfeng WangYaojiang ZhangJames L. DrewniakJun FanBruce Archambeault
- Challenges of Wire Bonding In High Value and High Performance Medical DevicesJames A. Ohneck
- Pb-free v/s Tin-Lead Reliability Comparison for Telecom/High Reliability ApplicationsGanesh IyerGnyaneshwar RamakrishnaLavanya GopalakrishnanKuo-Chuan Liu
- Spin Coating of Dielectrics on Thin Silicon To Enhance Strength CharacteristicsFred HaringSyed Sajid AhmadNathan SchneckKaycie GerstnerNicole DallmanChris HoffarthAaron Reinholz
- Pure Palladium and Palladium Phosphorus Depositions Used in ENEPIG and ENEP Surface Finishes – Comparison of Physical Properties and Their Influence on Soldering and Au Wire BondingMustafa OezkoekHugh RobertsJoe McGurran
- Characterization of Substrate Materials For End-Use Environment ClassificationSyed Sajid AhmadArun ShankaranFred HaringJustin VignesBernd ScholzAaron Reinholz
- Dynamic Mechanical Analysis of Printed Circuit Board LaminatesJ. Kuczynski
- 3D IC Technology: the Perfect StormPhilip Garrou
- Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition ProcessBernd ScholzWeiYang LimFerdous SarwarSyed Sajid AhmadAaron Reinholz
- Processing aspects to achieve high-end hybrid backside illuminated imagersJoeri De VosKoen De MunckMehmet Akif ErismisPadmakumar Ramachandra RaoKiki MinoglouWenqi ZhangDeniz S. TezcanPiet De MoorPhilippe Soussan
- Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated Layers on Metal Core PCBBernd ScholzIsmir PekmicSyed Sajid AhmadAaron Reinholz
- On the Origins, Status, and Future of Flip Chip & Wafer Level PackagingAlan HuffmanPhilip Garrou
- High Frequency Measurement Techniques for On-Chip InductorsBruce C. KimDae-Hyun HanSeok-Ho Noh
- Effects of crystallographic orientation of Sn on electromigration behaviorKiju LeeKeun-Soo KimKimihiro YamanakaYutaka TsukadaSoichi KuritaniMinoru UeshimaKatsuaki Suganuma
- Characteristic Life Based Acceleration Transforms for Lead-Free Solder Joint Reliability under Thermal Cycling ConditionsMudasir AhmadKuo-Chuan Liu
- Advanced Thin Wafer Support Processes for Temporary Wafer BondingJeremy McCutcheonDongshun Bai
- Selected Applications and Processing for Low Temperature Cofired CeramicKen A. PetersonDaniel S. KruegerCharles E. Sandoval
- Underfill For Ultra-Low Bumped (10μ) 3D PackageMary LiuWusheng Yin
- High Aspect Ratio Package Core Production with Electrolytic Deposited CopperStephen KennyBernd Roelfs
- The Future of Maximum CAD/CAM Automation for Ceramic HybridsJohn Sovinsky
- Enabling Robust Copper Fill of High Aspect Ratio Through Silicon ViasMark WilleyDamo SrinivasSesha VaradarajanDavid PorterEaswar SrinivasanDennis HausmannJon HenriHu KangMayur TrivediTom Mountsier
- Modeling and Optimization of Bond Wires as Transmission Lines and Integrated Antennas at RF/Microwave FrequenciesIvan NdipChristian TschobanStefan SchmitzAndreas OstmannMartin Schneider-RamelowStephan GuttowskiHerbert ReichlKlaus-Dieter Lang
- Validated High Speed Pull and Shear Test Methodologies to Evaluate Pb-Free BGA Mechanical StrengthMudasir AhmadRavi AssudaniDrew NelsonAmir Youssef
- Statistical Analysis Approach to Improve the High Speed Signal Quality by Including the Manufacturing Process Variations of Printed Circuit BoardSeungyong BaekMike SapozhnikovWarren MeggittPhilip PunJason VisneskiRamesh VelugotiAmit Agrawal
- Nanoindentation Characterization of Lead-free Solders and Intermetallic Compounds under Thermal AgingTong JiangFubin SongChaoran YangS. W. Ricky Lee
- Free Air Ball Consistency of Palladium Coated Copper WireJohnny YeungSylvia SutionoEugen Milke
- A Miniaturized Ground Surface Perturbation Lattice for Noise/Coupling Mitigation in Packaging ApplicationsAntonio Ciccomancini Scogna
- A First Individual Solder Joint Encapsulant AdhesiveMary LiuWusheng Yin
- AuSi and AuSn Eutectic Die Attach Case Studies from Small (12 mil) to Large (453 mil) DieDaniel D. EvansZeger Bok
- Advanced 3D Packaging of Miniature Biomedical SensorsDohyuk HaTse-Yu LinByung Guk KimPedro P. IrazoquiWilliam J. Chappell
- A New Coreless Substrate TechnologyBernd K. AppeltAlex S.F. HuangBruce SuYi-Shao Lai
- Electrical Analysis and Modeling of 3D Through-Strata-Vias (TSVs) and PadsZheng XuAdam BeeceKenneth RoseJian-Qiang Lu
- Investigation of Silver Migration Impacts on Microwave Systems Fabricated on LTCC Substrate Under High-Power RF Excitation and High Temperature and Humidity Conditions.Deepukumar M. NairK. M. NairKen SoudersMichael SmithMark McCombsJames ParisiTim MobleyBradley Thrasher
- Drop Test Simulation for the Component-Level Reliability of Module PackagesYu GuDaniel Jin
- Study on Thermal Proof of SnO2 Protection Thin Film for Ultra High Reflective Film Ag SystemH. MiyagawaR. SatohY. IwataE. MorinagaS. Kamo
- Characterization of Black Pad Defect on Electroless Nickel- Immersion Gold (ENIG) Plated CircuitsAdam W. MortensenRoger M. Devaney
- Practical Implementation of Frequency Monitoring for Widely Tunable Bandpass FiltersHjalti H. SigmarssonEvan BinkerdJeff MaasJuseop LeeDimitrios PeroulisWilliam J. Chappell
- New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman ThermographyM. FaqirA. ManoiT. MrotzekS. KnippscheerM. MassiotM. BuchtaH. BlanckS. RochetteO. VendierM. Kuball
- Predicting Fusing Current for Encapsulated Wire Bonds under Transient LoadsAditi MallikRoger Stout
- 2nd Level Reliability Improvement on WLCSPSeungwook ParkJupyo HongChangbae LeeSunhee MoonJinsoo KimHyungjin JeonDojae YooYoungdo Kweon
- HIGHLY IONIZED SPUTTERING FOR TSV-LININGMohamed ElghazzaliJürgen Weichart
- Optimization of photovoltaic power generation using a Measurement and Management Technology (MMT) platformLevente J. KleinSergio Bermudez RodriguesSatya NittaRobert SandstromSupratik GuhaHendrik Hamann
- Chip Embedding for Printed Circuit Boards and SubsystemsThomas GottwaldAlexander Neumann
- Investigation on the failure criterion of reliability testing for Pb-free BGA packagesWeidong XieTae-Kyu LeeKuo-Chuan LiuJie Xue
- Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale PackagingPaul Enquist
- Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnectsTae-Kyu LeeWeidong XieThomas R. BielerKuo-Chuan LiuJie Xue
- Inkjet Printing of Thick-Film ResistorsMarcel WassmerWaldemar DielKlaus Krueger
- Filling and Planarizing Deep Trenches with Polymeric Material for Through-Silicon Via TechnologyR.K. TrichurM. FowlerJ.W. McCutcheonM. Daily
- Achieving Ceramic-like RF Capacitor Requirements with Organic-based MaterialsJin-Hyun HwangJohn AndresakisBob CarterYuji KageyamaFujio Kuwako
- Using In situ Capacitance Measurements to Monitor the Stability of Thermal Interface Materials in Complex PCB AssembliesMichael GaynesTimothy ChainerEdward YarmchukJohn TorokDavid EdwardsDavid OlsonKatie Pizzolato
- EE Cars Architecture & Linked ECU: Constraints and New NeedsEl Khamis KadiriEric FittererBertrand Delord Manson
- Inkjet Printable Dispersions of Silver and Gold NanoparticlesKrishna BalantrapuLu LuIonel HalaciugaDan V. Goia
- Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element AnalysisAditi MallikRoger Stout
- A Systematic Approach for Creating a System-In-Package (SIP)Sam SadriTri LeStephanie A. Althouse
- The Microelectronic Wire Bond: Past, Present, and FutureHarry K. Charles
- Ferro-Electrically Enhanced Proximity Communication.Ivan ShubinJohn E. CunninghamDarko PopovicHiren ThackerXuezhe ZhengYing LuoJim MitchellKannan RajAshok V. KrishnamoorthySteve ZamekWinnie ChenArka Majumdar
- Hermetic Sealing of Stainless Steel Packages by Seam Seal WeldingThomas MarinisBerj Nercessian
- Interconnect Failure Rate Estimation Based on the Extreme Value DistributionMark PlucinskiMark Hoffmeyer
- High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow UnderfillSangil LeeDaniel F. Baldwin
- Accurate and Efficient BER Calculation by Statistical Simulation Based on Physical Transmit Jitter ModelFangyi RaoSanjeev Gupta
- Direct Printing/Micro-dispensing Solution for 3D Coating ApplicationsXudong ChenKenneth Church
- A Novel Metal Core Substrate with Simplified Manufacturing Process and High Adhesion Conformal Dielectric and Circuitry Metal for High Density Chip-Scale Packaging ApplicationsSyed Sajid AhmadJohn JacobsonZane JohnsonKevin MattsonAaron ReinholzNathan SchneckBernd ScholzGreg Strommen
- Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and AssemblyWeijun ZhouQuan YuanChris LiStephen F. HahnKurt A. KoppiBerend Hoek
- 2 mils Au wire interchip wedge bond cratering studyWang ZhiJieTony LimJiang YingWeiZhang ChangLiangHaengsun ChoiKwansun Hwang
- Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security BumpChunyan NanMichael MayerY. Norman ZhouJairus L. PisiganJohn PersicYoung-Kyu SongHenry Bathan
- Solid-State Formation of Intermetallic Compounds in Co-Sb Couple NanowiresSeong Gi JeonJae Yong SongHo Sun ShinJin Yu
- Nanomaterials for “Green” ElectronicsRabindra N. DasKonstantinos I. PapathomasMark D. PoliksVoya R. Markovich
- Design, Fabrication, Electrical Characterization and Reliability of Nanomaterials Based Embedded PassivesRabindra N. DasJohn M. LaufferSteven G. RosserMark D. PoliksVoya R. Markovich
- High-Dielectric-Constant PLZT Films on Metal Foils for Embedded PassivesBeihai MaManoj NarayananU. (Balu) Balachandran
- Kinetic Heat SinkVijay KhannaGerard McVickerSri M. Sri-Jayantha
- THERMAL MANAGEMENT SOLUTIONS FOR THE LED MARKETK. Andrew KintzSara N. PaisnerM. Shane Thompson
- Fine Feature Solder Paste Printing For Solder Sphere and Solder Trace ManufacturingNicole DallmanKaycie GerstnerKristi JeanFred HaringSyed Sajid AhmadAaron Reinholz
- Metal Coated Polymer Particles for Electronic PackagingIonel HalaciugaKeith RedfordDan V. Goia
- Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumpingJae-Woong NahPeter A. GruberPaul A. LauroClaudius Feger
- Implementation of a Virtual EMI Lab to Cost-Effectively Tackle Multi-Gigahertz EMI ChallengesHany FahmyChen WangDavy PissoortAmolak Badesha
- “Cleaning”- The Dirty Word in Packaging AssemblyRich Brooks
- Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First BenefitsNitesh KumbhatFuhan LiuVenky SundaramVivek SridharanAbhishek ChoudhuryHunter ChanRao Tummala
- Study of Grounding Schemes Utilized in Conformal Shielding ApplicationsScott MorrisDan Carey
- Ink-jetting for Electronic AssemblyGeorg Meyer-BergGottfried BeerKlaus Pressel
- Successful Practices for the Modeling of Printed Circuit Boards and Substrates Using Electromagnetic Field SolversSteven G. PytelScott C. McMorrowTom DagostinoSergey PolstyankoWerner ThielRichard Hall
- A Ceramic Clevis Sensor For Online Substance Concentration Measurement, Manufactured By Ceramic Injection MoldingMatthias HartmannSteffen DoernerSoeren Hirsch
- High via density thin metal-core PCB using electro-coated dielectricBernd ScholzIsmir PekmicSyed Sajid AhmadAaron Reinholz
- The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE ProcessingColin StevensRobert DeanSamuel LawrenceLee Levine
- MEMS Device Sealing in a High Vacuum Atmosphere Achieving Long Term Reliable Vacuum LevelsPaul W. Barnes
- A Method to Quickly Measure the Thickness of Aluminum Bond Pad on Silicon SubstrateSon NguyenZ. Joan DelalicHorst Clauberg
- Immersion Silver as Universal Surface Finish for COB TechnologyJ. GoehreM. Schneider-RamelowK.-F. BeckerM. Hutter
- New Mixed Metal Transition Via-Fill Conductors for Cost Effective DuPont GreenTape™ 951 & 9K7 LTCC CircuitsK. M. NairM.F. McCombsK.E. SoudersS. E. Gordon
- A Novel TSV Etching using NLD and VHF CCP Plasma For 3-D Stacked Devices.Yasuhiro MorikawaTakahide MurayamaManabu YoshiiKoukou Suu
- Laser Patterning and Via Drilling of Sapphire Wafers and DieJustin VignesFred HaringSyed Sajid AhmadKaycie GerstnerAaron Reinholz
- PCB Effects on On-chip Capacitor Requirements and an Efficient Resonance-Prevention ASIC MethodologyTimothy BudellEric Tremble
- Packaging in IBIS-AMI TechnologyDaniel DvorscakDale BeckerMatteo CocchiniSteven G. PytelIsaac WaldronDanil Kirsanov
- Understanding Cleaning of Vias Fabricated Using Micro Mechanical Punching in Liquid Crystal Polymer (LCP) SubstrateMohammad K. ChowdhuryLi SunShawn J. CunninghamAjay P. Malshe
- Low temperature wafer level packaging technology of bulk-micromachined MEMS deviceHeung Woo ParkSeung Hun HanHyun Kee LeeYeong Gyu LeeSeoung Ho KimBok Gun MoonTaek Hee YunMin Seok JangSi Joong YangSang Hun ParkSung Jun LeeWon Kyu JeungJung Won Lee
- TSV Modeling Considering Signal Integrity IssuesIvan NdipBrian CurranKai LöbbickeStephan GuttowskiHerbert ReichlKlaus-Dieter Lang
- Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect StructureEric OuyangMyoungSu ChaeSeng Guan ChowRoger EmighMukul JoshiRob MartinRaj Pendse
- Silicon Micro-Fabrication Technologies for Micro-FiltersBivragh MajeedWim De MalscheLei ZhangPaolo FioriniDeniz Sabuncuoglu TezcanPhilippe Soussan
- The performance over the frequency range 140GHz–220GHz of thick-film CPW lines fabricated from nano-particle silverA. AlshehriM. HoraczekD. RudkaR.J. LeighM. JakubowskaM. SlomaC.E. Free
- Improved Bond reliability through the use of Auxiliary Wires (Security Bumps and Stand-Off Stitch)David J RasmussenRodney Thompson
- Packaging of a Fingerprint Based Access Control SystemZdenka J. DelalicSandeepsarma JosyulaB Anand
- A robust CUP pad structure design with thin pad metal for Cu wire bondingChangHee HanSG KimJH ShimDH JiangSW KoBJ LeeKC KimHG LeeJS YoonBT JiangSW HongHD KimIS YooYS SongDalSoo KimShihyun Choe
- Effects of Electromigration(EM) on the Kirkendall Void Formation in Sn-3.5Ag/Cu Solder JointsYong JungJin Yu
- Hardware Design for Novel Packaging of Multi-Cellular Meta-Processing UnitSon NguyenJoan DelalicBjorn Gruenwald
- Reliability Modeling to Enable Damage Assessments for Plated Through HolesGilad SharonDonald Barker
- Cost-Effective Alternatives to Palladium Activation – A Study on Autocatalytic Electroless Copper DepositionEdith SteinhäuserT.A. Magaya
- Development of a Low Voiding Solder Attach Process for Photovoltaic Cell AssembliesIan Hardy
- Low Temperature Bonding of High Density Large Area Array Interconnects for 3D IntegrationJason D. ReedMatthew LueckChris GregoryAlan HuffmanJohn M. LannonDorota S. Temple
- Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder JointsS. H. KimJin Yu
- Creating 3D specific systems: Architecture, Design and CADPaul D. FranzonW. Rhett DavisThor ThorolfssonSamson Melamed
- BRAIDED ELECTRICAL CONTACT ELEMENT BASED HIGH PERFORMANCE CONNECTORSMichael SalloumChe-Yu Li
- Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer IntegrationZhaozhi LiBrian J. LewisPaul N. HoustonDaniel F. BaldwinEugene A. StoutTheodore G. TessierJohn L. Evans
- Correlation of Dispense Characteristics of Conductive Inks to Substrate TemperatureFred HaringJustin VignesSyed Sajid AhmadArun ShankaranKaycie GerstnerNicole DahlmanAaron Reinholz
- Advanced microfluidic packaging for molecular diagnosticsM. PalmieriT. BarbuzziA. MaiernaM. MarchiG. MontalbanoG. PanviniT. RodenfelsW. Stoeters
- Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer ApplicationsErik VickScott GoodwinDorota Temple
- Effect of Dielectric Selection on Sintering Behavior of LTCCDaniel S. KruegerLaura AgeeCristie FadnerJ. Brent DuncanKen PetersonGreg HilmasShi C. ZhangWayne Huebner
- Improved Design of a High Density 3D Multichip Module for Class I Medical DevicesDoug LinkMichael Kollar
- Structural Electronics through Additive Manufacturing and Micro-DispensingRichard OlivasRudy SalasDan MuseEric MacDonaldRyan WickerMike NewtonKen Church
- A Study on the Mechanism of Black Pad Formation during Electroless Nickel Immersion Gold processJ. H. KimK. H. KimJin Yu
- Global Technology Survey of Anisotropic Conductive Interconnect Technologies, Past Present and Future - An Industry Intellectual Property ApproachEdmar M. AmayaGene A. Lang
- Debye Model Fitting for Time-Domain Modeling of Lossy DielectricsA. Ege Engin
- Electromigration Performance of Pb-Free μPILR™ Flip-Chip PackagesRajesh KatkarLaura Mirkarimi
- Modeling of a heterojunction bipolar transistor based AlGaAs / GaAsA. BediaD. GhaffourA. Guen-BouazzaB. BouazzaK. Ghaffour
- Next Generation High Dk, Low Df Organic Laminate for RF Modules and High Frequency ApplicationsFuhan LiuVivek SridharanTapobrata BandyopadhyayVenky SundaramRao TummalaKiyoshige KojimaNaomi ShigaToshihiko Jimbo
- Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology.Sarah GromanNeil Jones
- Identifying and Working with Government RegulationsKelly Raia
Marinis, Thomas, and Berj Nercessian. 2010. “Hermetic Sealing of Stainless Steel Packages by Seam Seal Welding.” IMAPSource Proceedings 2010 (1): 720–30. https://doi.org/10.4071/isom-2010-WP5-Paper6.