Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancement

Mustafa Özkök; Hubertus Mertens; Jerome Bender

doi:10.4071/isom-2013-WP25

Özkök, Mustafa, Hubertus Mertens, and Jerome Bender. 2013. “Immersion Tin for QFN Packages to Create a 3-D Solder Joint for Reliability Enhancement.” IMAPSource Proceedings 2013 (1): 663–66. https://doi.org/10.4071/isom-2013-WP25.

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Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancement

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