ISSN 2380-4505
Articles in Vol. 2013, Issue 1, 2013
Vol. 2013, Issue 1, 2013
- High Temperature Sintered Interconnects Formed by Transient Liquid Phase SinteringHannes GreveF. Patrick McCluskey
- Active and passive component embedding into low-cost plastic substrates aimed at smart system applicationsMaarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar
- Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect TechnologyWoon-Seong KwonMyongseob KimJonathan ChangSuresh RamalingamLiam MaddenGenie TsaiStephen TsengJ.Y. LaiTerren LuSteve Chiu
- Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a DesignYi-Chuan TsaiMei-Ling Wu
- Glass Interposer Substrates: Fabrication, Characterization and ModelingAric ShoreySatish ChaparalaScott PollardGarrett PiechJohn Keech
- RF Capacitor Material for Use in Printed Circuit BoardJin-Hyun HwangJohn AndresakisEthan FeinbergBob CarterYuji KageyamaFujio Kuwako
- Performance and Process Comparison between Glass and Si Interposer for 3D-IC IntegrationChun-Hsien ChienChing-Kuan LeeHsun YuChang-Chih LiuPeng-Shu ChenHeng-Chieh ChienJen-Hau ChengLi-Ling LiaoMing-Ji DaiYu-Min LinChau-Jie ZhanCheng-Ta KoWei-Chung LoYung Jean (Rachel) Lu
- An Analysis of Evolving Package Reliability Test Methodologies for Wireless ApplicationsMichael Ferrara
- DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applicationsZhuowen SunKevin ChenRichard Crisp
- Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid BoardsGary GuJon ChadwickDaniel Jin
- A Photo-Desmear Method for Via Residue Removal Using a VUV Light SourceTomoyuki HabuShintaro YabuKenichi HiroseHiroki HoribeToru FujinamiNaoki KitanoEiji OzawaSanchali BhattacharjeeEbrahim AndidehDaniel Sobieski
- Electrical characterization of TSVs with varying process knobs and temporary bond/adhesive system robustness studies for 2.5D/3D manufacturingNiranjan Kumar
- Improvement of Back-Side Cosmetic Defects And Wafer StrengthVictoria L. Calero-DdelCIrene PopovaAaron BicknellRichard IndykJoe SullivanJohn Fitzsimmons
- Decision Making Model for the Emerging NanotechnologiesAudré DixonKewal K. Verma
- “Front-end-ization” of the Back-EndRajiv Roy
- Development of Organic Multi Chip Package for High Performance ApplicationNoriyoshi ShimizuWataru KanedaHiromu ArisakaNaoyuki KoizumiSatoshi SunoharaAkio RokugawaToshinori Koyama
- A Solder Joint Reliability Model for the Philips Lumileds LUXEON Rebel LED Carrier Using Physics of Failure MethodologyRudi HechfellnerMichiel KrugerTewe HeemstraGreg CaswellNathan BlattauVikrant More
- Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV IntegrationZidong WangMichael GallagherKevin WangElissei IagodkineMark OliverJoe LachowskiGreg ProkopowiczEric HuengerRaymond ThibaultZhifeng BaiChristopher TuckerMatthew BishopScott KistingLynne MillsDavid Louks
- Non-contact characterization of printed resistorsMaria F. Cordoba-ErazoThomas M. Weller
- The Next Level of Accurate Server Power Monitoring and CappingJerry Steele
- Si Vapor Chamber Integrated with Through Silicon Via for 3D PackagingJun TaniguchiTakeshi ShiogaYoshihiro Mizuno
- Novel Backside Grinding and Laser Dicing Process for Cu Pillar Generated Low-k WaferYuka TamadateHideki MaruyamaKatsunori AokiTakashi OzawaHaruo Sorimachi
- Microfluidic Device PackagingLeland “Chip” Spangler
- Low-Temperature Co-fired Ceramic (LTCC) Technology for Development of Sensors for Emerging ApplicationsH. BirolS. LoperaG. FarineT. MaederW.B. QuintãoJ. GervasioE. GyoervaryL.O.S. CesarJ. BuntaineP. Ryser
- Non-Destructive Top Layer Bond Pad Cross SectionTerence Q. CollierIndira Gubeljic
- Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applicationsM. EkpuR. BhattiM.I. OkerekeK.C. Otiaba
- Inspection and Metrology Solutions from TSV through Reveal for High Volume ManufacturingRuss DudleyDavid MarxRajiv RoyDavid GrantMatt WilsonScott Balak
- High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining ProcessY. KawaseM. IkemotoM. YamazakiM. SugiyamaH. KiritaniF. MizutaniK. MatsumotoA. HoribeH. MoriY. Orii
- Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle TestsGordon ElgerShri Vishnu KandaswamyRobert DerixJürgen Wilde
- Preparation of a Wafer-level Micro Polymer Lens Array With Improved Performance Using a Low Cost Glass MoldMengying MaShunjin QinJintang ShangChunwei ZhangLi ZhangDong ChenChiming Lai
- Effects of Sb and Zn Addition on Impact Resistance Improvement of Sn-Bi Solder JointsKeishiro OkamotoKenji NomuraShuichi DoiToshiya AkamatsuSeiki SakuyamaKeisuke Uenishi
- A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO ApplicationsLaura MirkarimiRajesh KatkarRon ZhangRey CoZhijun Zhao
- Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturingF. RoozeboomM. SmetsB. KniknieM. HoppenbrouwersG. DingemansW. KeuningW.M.M. KesselsR. PohlA.J. Huis in't Veld
- Effects of minor alloying additive on the shear strength of Sn-58Bi solder jointOmid MokhtariHiroshi Nishikawa
- Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly SolutionMary LiuWusheng Yin
- An overview of molded underfill in flip chip packaging applicationsFernando Roa
- Mechanical Stress Analyses of Packaged Pressure Sensors for Very High TemperaturesRoderich ZeiserSuleman AyubJochen HempelMichael BerndtJuergen Wilde
- Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate SideMarek GorywodaRainer DohleStefan HärterAndreas WirthJörg GoßlerJörg Franke
- Multi Beam Low-κ Grooving Evaluation of various removal principalsRichard van der StamJeroen van BorkuloPeter Dijkstra
- Using Physics of Failure to Predict System Level Reliability for Avionic ElectronicsGreg Caswell
- Compact Photonic Package for High-Power E-Band (60–90 GHz) Photoreceiver ModulesV. RymanovM. PalandökenS. DülmeT. TekinA. Stöhr
- Cu Heavy Wirebonding for High Power Device InterconnectionBaik-Woo LeeChang-Sik KimChangmo JeongYounghun ByunJeong-Won YoonChe-Heung KimSeong Woon BoohU-in Chung
- Z-Axis Interconnection: A Versatile Technology Solution for High Performance ElectronicsRabindra N. DasJohn M. LaufferFrank D. Egitto
- Method to Measure Effects of Surface Roughness on High-frequency Transmission LinesToshiki IwaiDaisuke MizutaniMotoaki Tani
- Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost InterposersKwang-Seong ChoiHo-Eun BaeHaksun LeeHyun-Cheol BaeYong-Sung Eom
- Ag wire and Ag alloy wire reliability and molding compoundsAya MizushimaShinichiro KatoHidenori AbeNaoki SadayoriYoshinori EndoKazuhiko YasuharaJun ChibaTomio Iwasaki
- Hybrid In-Mould IntegrationTeemu AlajokiMatti KoponenArttu HuttunenMarkus TuomikoskiMikko HeikkinenAntti KeränenKimmo KeränenJukka-Tapani MäkinenTuomo JaakolaJanne AikioKari Rönkä
- Low temperature Si-Si, SiO2-SiO2 covalent bonding structures with thin siloxane layerJeongyub LeeKunmo ChuYongyoung ParkWooyoung YangWenxu XianyuChangyoul Moon
- Biomedical sensor packaging failures: Regulations are not design standardsColin K. Drummond
- Thick film pastes for nitride ceramics for high power applicationsMarco WenzelRichard SchmidtUwe PartschMarkus Eberstein
- A current-controlled pcb integrated mems tilt mirrorRobert N. DeanColin B. StevensJohn J. Tatarchuk
- A Switched-Line Phase Shifter Fabricated with Additive ManufacturingJonathan M. O'BrienEduardo RojasThomas M. Weller
- Embedded Photonics Interconnect Eco-system for Data Center ApplicationsRichard PitwonKai WangAlex Worrall
- Improved compensation for a reduction stepper to meet the challenges for advanced packaging applicationsJames E WebbSteven GardnerElvino DaSilveira
- A NOVEL HIGH THERMAL CONDUCTIVE UNDERFILL FOR FLIP CHIP APPLICATIONMary LiuWusheng Yin
- A Wide I/O Memory-on-Logic Product Prototype Enabled by Through-Silicon Stacking TechnologyVidhya RamachandranDong Wook KimSam GuRon LindleyBrian HendersonUrmi RayRiko RadojcicMatt NowakAurel GunterusAmer CassierSharon ChenM. F. ChenC. H. WuS. P. JengC. H. Yu
- Electromigration in Lead – Free Solder: A Power IC PerspectiveThomas A. Wassick
- Production Proven, High Precision Temporary Bond/De-bond ProcessBlake DronenAric ShoreyB.K. WangLeon Tsai
- Electrografted insulator layer as copper diffusion barrier for TSV interposersV. MevellecF. RaynalD. SuhrT. DequivreL. Religieux
- Influence of the organic vehicle and inorganic additives on the properties of thick film pastes for AlNRichard SchmidtMarco WenzelKathrin ReinhardtUwe PartschLars RebenklauMarkus Eberstein
- The Effectiveness of Screening Techniques for Revealing Cracks in High Volumetric Efficiency MLCCsAlexander Teverovsky
- Assembly and Packaging Enabling System IntegrationKlaus PresselGottfried BeerMaciej Wojnowski
- Anti-Counterfeit, Advanced Microelectronics Packaging Solutions for Miniaturized Medical DevicesRabindra N. DasFrank D. EgittoHow Lin
- Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder jointHao ZhangQing-Sheng ZhuZhi-Quan LiuLi ZhangHongyan GuoChi-Ming Lai
- 3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric EfficiencyMichael VincentDoug MitchellJason WrightYap Weng FoongAlan MagnusZhiwei (Tony) GongScott HayesNavjot Chhabra
- Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging MaterialsMamadou Diobet DiopMarie-Claude PaquetDominique DrouinDavid Danovitch
- Non-Hermetic Micropackage for Chronic Implantable SystemsP. WangS.B. LachhmanD. SunS.J.A. MajerusM.S. DamaserC.A. ZormanP.X.-L. FengW.H. Ko
- Application of Low-k Liner for Stress and Capacitance Control in Cu-TSVC. S. TanL. ZhangH.Y. LiW. Yoo
- High and Moderate-Level Vacuum Packaging of Vibratory MEMSIgor P. PrikhodkoBrenton R. SimonGunjana SharmaSergei A. ZotovAlexander A. TrusovAndrei M. Shkel
- Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die PackageMichael LyakasCorey ReichmanMiguel JimarezRomina Mimi OcampoAaron ElbergAltaf HasanDierdre HaleFred HamiltonJoon Dong Kim
- Thermo-mechanical Stress of Underfilled 3D IC PackagingMing-Han WangMei-Ling Wu
- Moisture and Hydrogen Release in Optoelectronic Hermetic PackagesM. AlbarghoutiN. El DahdahG. PerosevicS. JainJ-M PapillonS. Fernandez
- Organic Chip Scale Package (CSP) Development for Flip Chip ApplicationsTomoyuki YamadaMasahiro FukuiKenji TeradaMasaaki HarazonoTeruya FujisakiCharles ReynoldsJean AudetYi PanScott MooreSushumna IruvantiHsichang LiuHongqing ZhangBrian Sundlof
- Evaluation of Epoxy Flux for Use in Hearing Aid SMD AssembliesSusie JohanssonJohn Dzarnoski
- Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder InterconnectsSandeep MenonAdam PearlMichael OstermanMichael Pecht
- Thermal Cycling Reliability of Alternative Low-Silver Tin-based SoldersElviz GeorgeMichael OstermanMichael PechtRichard CoyleRichard ParkerElizabeth Benedetto
- Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technologyKoji SasakiNoritsuka Mizumura
- Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical EnvironmentJia-Shen LanMei-Ling Wu
- Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag AlloysYan LiuJoanna KeckErin PageNing-Cheng Lee
- Heat Sink Induced Thermo-Mechanical Joint Strain in QFN DevicesGerard McVickerVijay KhannaSri M. Sri-Jayantha
- Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC IntegrationJ. H. LauH. C. ChienS. T. WuY. L. ChaoW. C. LoM. J. Kao
- RF MEMS DPDT Switch Using Novel Simulated Seesaw DesignMohammed Al-AminSufian YousefBarry Morris
- Multi-layer PC boards Fabricated using Aerosol-jet PrintingJohn BolgerLeon LantzRich LewisRick TrudeauDaniel Hines
- An Overview of Isotropic Conductive Adhesives Filled with Metal-coated Polymer SpheresHoang-Vu NguyenKnut E. AasmundtveitHelge KristiansenTore Helland
- Size Matters – Embedding as an Enabler of Next-Generation SiPsNick Renaud-Bezot
- DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATIONG. ParèsA. AttardF. DosseulA. N'HariO. BoillonL. ToffaninG. KlugG. Simon
- A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POPMing HuLee KresgeNing-Cheng Lee
- Automated Wirepull Testing – Parallelogram of Forces-Real Time ApplicationRichard C. GarciaJosef Sedlmair (F&K Delvotec)
- Adhesion and Cure Mechanism Studies for Advanced Lidded Flip Chip ApplicationsLyndon J. LarsonKristen E. Steinbrecher
- Stacking of known good rebuilt wafers for high performance memory and SiPPascal CoudercJerome NoirayChristian Val
- Integrated Passive Devices and TSV, a disruptive technology for miniaturizationC. BunelJ-R. TenailleauF. VoironS. BorelA. Lefevre
- Flip-chip Packages with Periphery Cu Pillar Bumps as Wire Bond Replacement—Design, Modeling & CharacterizationZhe LiSiow Chek TanYee Huan YewPheak Ti TehMJ LeeJohn Xie
- Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bondingAstrid-Sofie B. VardøyH.J. van de WielStian MartinsenGreg R. HayesHartmut R. FischerKnut E. AasmundtveitAdriana LapadatuMaaike M. V. Taklo
- Small-chip Attachment on Copper Leadframe with Sintered Nanosilver PasteJesus N. CalataHanguang ZhengGuo-Quan LuKhai NgoLuu Nguyen
- Challenges of Adhesion Promotion for the Metallization of Glass InterposersSimon BambergMichael MerschyTobias BernhardFrank BrueningRobin TaylorLutz BrandtZhiming LiuHailuo FuSara Hunegnaw
- Cost Comparison of 2.5D/3D Packaging to other Packaging TechnologiesChet PaleskoAmy PaleskoE. Jan Vardaman
- Moisture Reliability Improvement of a High Performance Depletion Mode 0.15 um Gate PHEMT ProcessJon AbrokwahJohn StanbackJerry WangMolly JohnsonChi L. Jiaa
- Thermal Characteristic and Performance of the Glass Interposer with TGVs (Through-Glass Via)Heng-Chieh ChienChun-Hsien ChienMing-Ji DaiRa-Min TainWei-Chung LoYung-Jean Rachel Lu
- 3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End ElectronicsRabindra N. DasFrank D. EgittoSteven G. RosserErich KoppBarry BonitzRaj Rai
- LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSPGeorge SearsGuoyun TianDuy LeHeather Bradley
- Better, Faster and Cheaper Precision Cleaning: Advanced CO2 Cleaning TechnologyDavid Jackson
- Implementing Inductor Function with Vibrating Capacitor StructuresThomas F. MarinisJoseph W. Soucy
- Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding CompoundsK.-F. BeckerT. ThomasJ. BauerR. KahleT. BraunR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- Compression molding solutions for various high end Package and Cost savings for standard Package applicationsMuneo Miura
- Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and MaterialsA. RezvaniM. MayerI. QinJ. BrunnerBob Chylak
- Modeling and Reliability Analysis of TSVs for High Frequency ApplicationsKaushal KannanBruce KimSukeshwar KannanSeok-Ho Noh
- Packaging Materials for 2.5/3D TechnologyBrian Schmaltz
- Analysis of stress/strain in Electroless Copper FilmsTobias BernhardSimon BambergFrank BrüningRalf BrüningLaurence J. GregoriadesTanu SharmaDelilah BrownM. KlausCh. Genzel
- Transferable Redistribution Layers (TRDL)Suzanne DunphyDavid Herndon
- Effect of Voiding in Solder Joints on Thermal Performance of the LEDJianbiao Pan
- A Study on the Effectiveness of Underfill in the High Bandwidth Memory with TSVWoong-Sun LeeDae-Woong LeeHo-Young SonJin-Su LeeMin-Suk SuhNick KimKwang-Yoo Byun
- Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold CompoundsVarughese MathewSheila ChopinLeo HigginsYingrui Zhang
- Modular Microsystems with Embedded ComponentsChristian BoehmeAndreas OstmannMartin Schneider-Ramelow
- Lithography Process Optimization for 3D and 2.5D ApplicationsDoug SheltonTomii Kume
- Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module PackageHaotao KeYang XuDouglas C Hopkins
- Silver oxalate: towards a new solder material for highly dissipative electronic assembliesK. KiryukhinaH. Le TrongP. TailhadesJ. LacazeM. GougeonV. BacoF. CourtadeS. DareysO. VendierL. Raynaud
- A STUDY ON PREVALENT FACTORS BEHIND EFFICIENCY DETERIORATION OF A TYPICAL LOW POWER SOLAR PANELV. GanescuA. Pascu
- Package design and development of a low cost high temperature (250°C), high current (50+A), low inductance discrete power package for advanced Silicon Carbide (SiC) and Gallium Nitride (GaN) devicesB. McPhersonB. PassmoreP. KilleenD. MartinA. BarkleyT. McNutt
- Integrated Ψ-Type Photonic Polarization Diversity Receivers for Wireless Radio-over-Fiber Communication LinksV. RymanovS. DülmeM. WachholzM. PalandökenT. TekinA. Stöhr
- Analysis of the Thick Film Deposited on Alumina Substrate and Effect of Different Parameters on the Response of Propanol Using Taguchi MethodIbrahim Gaidan
- A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic TechnologyMichael D. GloverMichael C. HamiltonEmmanuel DecrossasKaoru PorterAlexander PfeiffenbergerH. Alan Mantooth
- Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancementMustafa ÖzkökHubertus MertensJerome Bender
- Plating reliability and high frequency testing of DuPont™ GreenTape™ 9K7 LTCCAllan BeikmohamadiPatricia GraddyDeepukumar NairJim ParisiSteve Stewart
- Improving WLCSP Reliability Through Solder Joint Geometry OptimizationBoyd RogersChris Scanlan
- Precision Patterned Thin Films without Photolithography: Additive Manufacturing of Printed ElectronicsScott LauerWhitten LittleThomas AmbroseJeff ConradTim Cowen
- 3D Integrated Packaging Approach for High Performance Processor-Memory ModuleS. C. PolzerW. L. WilkinsJ. L. FasigM. J. DegerstromB. K. GilbertE. S. Daniel
- Thick Copper and Aluminum Wire Bonding Technology for High Power Laser DevicesKong Weng LeeLei XuJay Skidmore
- Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTu Anh TranVarughese MathewWen Shi KohK. Y. YowY. K. Au
- Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation EfficiencyDaniel D. Evans
- Modeling of Failure in Aluminum Alloy Braze for a High Temperature Thermoelectric AssemblyS. ArifeenG. PotirnicheA. ElshabiniF. Barlow
- Improving System Performance with eGaN® FETs in DC-DC ApplicationsDavid ReuschJohan StrydomAlex Lidow
- Chip Design of an 1 V RF Receiver Front-End for 5.8-GHz DSRC ApplicationsJhin-Fang HuangWen Cheng LaiYong-Jhen Jiangn
- Characterization of CVD Diamond for Thermal Management ApplicationsR.S. BalmerB. BolligerJ.M. DodsonD.J. Twitchen
- Fully 3D Printed 2.4 GHz Bluetooth/Wi-Fi AntennaPaul DeffenbaughKenneth ChurchJosh GoldfarbXudong Chen
- Redistribution Layers (RDLs) for 2.5D/3D IC IntegrationJ. LauP. TzengC. LeeC. ZhanM. LiJ. ClineK. SaitoY. HsinP. ChangY. ChangJ. ChenS. ChenC. WuH. ChangC. ChienC. LinT. KuR. LoM. Kao
- Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Wiring Board Trace Widths in a VacuumBennion CannonFrank FriedlGary Gisler
- Advanced warpage characterization for FOWLPJorge TeixeiraMário RibeiroNélson Pinho
- Thermally and Electrically Enhanced Wirebond BGABurton CarpenterBoon Yew LowLeo M. HigginsSriram NeelakantanRobert WenzelDaniel Boyne
- A friction based approach for modeling wire bondingSimon AlthoffJan NeuhausTobias HemselWalter Sextro
- Integrated Current Sensing Technology for Synchronous Buck ConvertersEvan ReutzelRengang ChenScott RagonaDavid Jauregui
- 2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE.Yasuhiro MorikawaTakahide MurayamaToshiyuki SakuishiKoukou Suu
- RF Device Integration on Glass Interposer toward 3D-IPAC PackagesYoichiro SatoBruce ChouVijay SukumaranJunki MinMotoshi OnoChoukri KarouiFranck DosseulChristian NopperMadhavan SwaminathanVenky SundaramRao Tummala
- Five layer Cu-coated Zn/Al clad solder for die attachmentTakuto YamaguchiOsamu IkedaShohei HataYuichi OdaKazuma Kuroki
- Warpage Characterization and Improvements for IC Packages with Coreless SubstrateBora BalogluWei LinKen StrattonMiguel JimarezDanny Brady
- Scaling Challenges of Semiconductor Packaging in the Era of Big DataYasumitsu OriiAkihiro HoribeKazushige ToriyamaKeiji MatsumotoHirokazu NomaSayuri KoharaToyohiro AokiKuniaki SueokaHiroyuki Mori
- Detailed Analysis of How Power Stage and Power Clip Products Achieve Optimized Power DensityArthur Black
- Study of Wirebonding on Thin Al Pads with Various Size Probe MarksAndrew ForhanShashi SharmaPrakash SubediDustin WhittakerStevan Hunter
- Droplet-on-demand Inkjet-filled Through-silicon Vias (TSVs) as a Pathway to Cost-efficient Chip StackingJacob SadieNiels QuackMing C. WuVivek Subramanian
- Packaging of 1.3 Tb/s Full Duplex Optical InterconnectShuki BenjaminKobi HasharoniStanislav StepanovGideon KatzAmir GeronMichael Mesh
- Next-Generation Lead-Free Solder Plating Products for High Speed Bumping, Capping and Micro-Capping ApplicationsJonathan PrangeJulia WoertinkYi QinPedro Lopez MontesinosInho LeeYil-Hak LeeMasaaki ImanariJianwei DongJeffrey Calvert
- Advanced Devices and Electronic Packaging for Harsh EnvironmentAicha ElshabiniFred BarlowSharmin IslamPin-Jen Wang
- Effects of Copper Pattern Density and Orientation on the Modulus of BGA SubstratesBurton CarpenterBetty YeungYuan Yuan
- Source-Sense Packages for HV MOSFETsAnders Lind
- Development of TGV Interposer for 3D ICShintaro TakahashiKentaro TatsukoshiMotoshi OnoMasaki MikayamaNobuhiko Imajo
- Stencil Printing Process Guidelines for 0.3mm Pitch Chip Scale PackagesMark WhitmoreJeff SchakeClive Ashmore
- Advanced Thermal Simulation Model for Power MOSFETsJens Ejury
- A Highly Integrated GaAs-based Module for DC-DC RegulatorsGreg J. Miller
- A fully automated execution of complex DOE to characterize electroplating bathsNorbert SchroederFred RichterJuerg StahlArnold Cziurlok
- Monitoring of Wet Etch for Wafer Thinning and Via Reveal ProcessChuannan BaiEugene ShalytGuang LiangPeter Bratin
- Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel StructuresDilshani Rathnayake-ArachchigeDavid A. HuttPaul P. Conway
- High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test StructureMin XuRobert GeerPavel KabosThomas Wallis
- Ultra-Thin Flexible Ceramic Membranes for Electronic ApplicationsJohn A. Olenick
- Electroless Ni plating solutions for reproducible black pad analyses.K.H. KimJin Yu
- Ultrasonically Enabled Low Temperature Electroless Plating for Advanced Electronic ManufactureA J CobleyJ E GravesA KassimB MkhlefB Abbas
Dunphy, Suzanne, and David Herndon. 2013. “Transferable Redistribution Layers (TRDL).” IMAPSource Proceedings 2013 (1): 349–53. https://doi.org/10.4071/isom-2013-TP52.