ISSN 2380-4505
Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Study of Wirebonding on Thin Al Pads with Various Size Probe Marks
Study of Wirebonding on Thin Al Pads with Various Size Probe Marks
Articles in Vol. 2013, Issue 1, 2013
Vol. 2013, Issue 1, 2013
- High Temperature Sintered Interconnects Formed by Transient Liquid Phase SinteringHannes GreveF. Patrick McCluskey
- Active and passive component embedding into low-cost plastic substrates aimed at smart system applicationsMaarten CauweBjorn VandecasteeleJohan De BaetsJeroen van den BrandRoel KustersAshok Sridhar
- Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect TechnologyWoon-Seong KwonMyongseob KimJonathan ChangSuresh RamalingamLiam MaddenGenie TsaiStephen TsengJ.Y. LaiTerren LuSteve Chiu
- Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a DesignYi-Chuan TsaiMei-Ling Wu
- Glass Interposer Substrates: Fabrication, Characterization and ModelingAric ShoreySatish ChaparalaScott PollardGarrett PiechJohn Keech
- RF Capacitor Material for Use in Printed Circuit BoardJin-Hyun HwangJohn AndresakisEthan FeinbergBob CarterYuji KageyamaFujio Kuwako
- Performance and Process Comparison between Glass and Si Interposer for 3D-IC IntegrationChun-Hsien ChienChing-Kuan LeeHsun YuChang-Chih LiuPeng-Shu ChenHeng-Chieh ChienJen-Hau ChengLi-Ling LiaoMing-Ji DaiYu-Min LinChau-Jie ZhanCheng-Ta KoWei-Chung LoYung Jean (Rachel) Lu
- An Analysis of Evolving Package Reliability Test Methodologies for Wireless ApplicationsMichael Ferrara
- DIMM-in-a-PACKAGE (DIAP) signal integrity for high-performance on-board memory applicationsZhuowen SunKevin ChenRichard Crisp
- Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid BoardsGary GuJon ChadwickDaniel Jin
- A Photo-Desmear Method for Via Residue Removal Using a VUV Light SourceTomoyuki HabuShintaro YabuKenichi HiroseHiroki HoribeToru FujinamiNaoki KitanoEiji OzawaSanchali BhattacharjeeEbrahim AndidehDaniel Sobieski
- Electrical characterization of TSVs with varying process knobs and temporary bond/adhesive system robustness studies for 2.5D/3D manufacturingNiranjan Kumar
- Improvement of Back-Side Cosmetic Defects And Wafer StrengthVictoria L. Calero-DdelCIrene PopovaAaron BicknellRichard IndykJoe SullivanJohn Fitzsimmons
- Decision Making Model for the Emerging NanotechnologiesAudré DixonKewal K. Verma
- “Front-end-ization” of the Back-EndRajiv Roy
- Development of Organic Multi Chip Package for High Performance ApplicationNoriyoshi ShimizuWataru KanedaHiromu ArisakaNaoyuki KoizumiSatoshi SunoharaAkio RokugawaToshinori Koyama
- A Solder Joint Reliability Model for the Philips Lumileds LUXEON Rebel LED Carrier Using Physics of Failure MethodologyRudi HechfellnerMichiel KrugerTewe HeemstraGreg CaswellNathan BlattauVikrant More
- Development of Laser and Photodefinable Toughened Benzocyclobutene Dielectric Materials for 3D-TSV IntegrationZidong WangMichael GallagherKevin WangElissei IagodkineMark OliverJoe LachowskiGreg ProkopowiczEric HuengerRaymond ThibaultZhifeng BaiChristopher TuckerMatthew BishopScott KistingLynne MillsDavid Louks
- Non-contact characterization of printed resistorsMaria F. Cordoba-ErazoThomas M. Weller
- The Next Level of Accurate Server Power Monitoring and CappingJerry Steele
- Si Vapor Chamber Integrated with Through Silicon Via for 3D PackagingJun TaniguchiTakeshi ShiogaYoshihiro Mizuno
- Novel Backside Grinding and Laser Dicing Process for Cu Pillar Generated Low-k WaferYuka TamadateHideki MaruyamaKatsunori AokiTakashi OzawaHaruo Sorimachi
- Microfluidic Device PackagingLeland “Chip” Spangler
- Low-Temperature Co-fired Ceramic (LTCC) Technology for Development of Sensors for Emerging ApplicationsH. BirolS. LoperaG. FarineT. MaederW.B. QuintãoJ. GervasioE. GyoervaryL.O.S. CesarJ. BuntaineP. Ryser
- Non-Destructive Top Layer Bond Pad Cross SectionTerence Q. CollierIndira Gubeljic
- Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applicationsM. EkpuR. BhattiM.I. OkerekeK.C. Otiaba
- Inspection and Metrology Solutions from TSV through Reveal for High Volume ManufacturingRuss DudleyDavid MarxRajiv RoyDavid GrantMatt WilsonScott Balak
- High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining ProcessY. KawaseM. IkemotoM. YamazakiM. SugiyamaH. KiritaniF. MizutaniK. MatsumotoA. HoribeH. MoriY. Orii
- Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle TestsGordon ElgerShri Vishnu KandaswamyRobert DerixJürgen Wilde
- Preparation of a Wafer-level Micro Polymer Lens Array With Improved Performance Using a Low Cost Glass MoldMengying MaShunjin QinJintang ShangChunwei ZhangLi ZhangDong ChenChiming Lai
- Effects of Sb and Zn Addition on Impact Resistance Improvement of Sn-Bi Solder JointsKeishiro OkamotoKenji NomuraShuichi DoiToshiya AkamatsuSeiki SakuyamaKeisuke Uenishi
- A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO ApplicationsLaura MirkarimiRajesh KatkarRon ZhangRey CoZhijun Zhao
- Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturingF. RoozeboomM. SmetsB. KniknieM. HoppenbrouwersG. DingemansW. KeuningW.M.M. KesselsR. PohlA.J. Huis in't Veld
- Effects of minor alloying additive on the shear strength of Sn-58Bi solder jointOmid MokhtariHiroshi Nishikawa
- Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly SolutionMary LiuWusheng Yin
- An overview of molded underfill in flip chip packaging applicationsFernando Roa
- Mechanical Stress Analyses of Packaged Pressure Sensors for Very High TemperaturesRoderich ZeiserSuleman AyubJochen HempelMichael BerndtJuergen Wilde
- Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate SideMarek GorywodaRainer DohleStefan HärterAndreas WirthJörg GoßlerJörg Franke
- Multi Beam Low-κ Grooving Evaluation of various removal principalsRichard van der StamJeroen van BorkuloPeter Dijkstra
- Using Physics of Failure to Predict System Level Reliability for Avionic ElectronicsGreg Caswell
- Compact Photonic Package for High-Power E-Band (60–90 GHz) Photoreceiver ModulesV. RymanovM. PalandökenS. DülmeT. TekinA. Stöhr
- Cu Heavy Wirebonding for High Power Device InterconnectionBaik-Woo LeeChang-Sik KimChangmo JeongYounghun ByunJeong-Won YoonChe-Heung KimSeong Woon BoohU-in Chung
- Z-Axis Interconnection: A Versatile Technology Solution for High Performance ElectronicsRabindra N. DasJohn M. LaufferFrank D. Egitto
- Method to Measure Effects of Surface Roughness on High-frequency Transmission LinesToshiki IwaiDaisuke MizutaniMotoaki Tani
- Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost InterposersKwang-Seong ChoiHo-Eun BaeHaksun LeeHyun-Cheol BaeYong-Sung Eom
- Ag wire and Ag alloy wire reliability and molding compoundsAya MizushimaShinichiro KatoHidenori AbeNaoki SadayoriYoshinori EndoKazuhiko YasuharaJun ChibaTomio Iwasaki
- Hybrid In-Mould IntegrationTeemu AlajokiMatti KoponenArttu HuttunenMarkus TuomikoskiMikko HeikkinenAntti KeränenKimmo KeränenJukka-Tapani MäkinenTuomo JaakolaJanne AikioKari Rönkä
- Low temperature Si-Si, SiO2-SiO2 covalent bonding structures with thin siloxane layerJeongyub LeeKunmo ChuYongyoung ParkWooyoung YangWenxu XianyuChangyoul Moon
- Biomedical sensor packaging failures: Regulations are not design standardsColin K. Drummond
- Thick film pastes for nitride ceramics for high power applicationsMarco WenzelRichard SchmidtUwe PartschMarkus Eberstein
- A current-controlled pcb integrated mems tilt mirrorRobert N. DeanColin B. StevensJohn J. Tatarchuk
- A Switched-Line Phase Shifter Fabricated with Additive ManufacturingJonathan M. O'BrienEduardo RojasThomas M. Weller
- Embedded Photonics Interconnect Eco-system for Data Center ApplicationsRichard PitwonKai WangAlex Worrall
- Improved compensation for a reduction stepper to meet the challenges for advanced packaging applicationsJames E WebbSteven GardnerElvino DaSilveira
- A NOVEL HIGH THERMAL CONDUCTIVE UNDERFILL FOR FLIP CHIP APPLICATIONMary LiuWusheng Yin
- A Wide I/O Memory-on-Logic Product Prototype Enabled by Through-Silicon Stacking TechnologyVidhya RamachandranDong Wook KimSam GuRon LindleyBrian HendersonUrmi RayRiko RadojcicMatt NowakAurel GunterusAmer CassierSharon ChenM. F. ChenC. H. WuS. P. JengC. H. Yu
- Electromigration in Lead – Free Solder: A Power IC PerspectiveThomas A. Wassick
- Production Proven, High Precision Temporary Bond/De-bond ProcessBlake DronenAric ShoreyB.K. WangLeon Tsai
- Electrografted insulator layer as copper diffusion barrier for TSV interposersV. MevellecF. RaynalD. SuhrT. DequivreL. Religieux
- Influence of the organic vehicle and inorganic additives on the properties of thick film pastes for AlNRichard SchmidtMarco WenzelKathrin ReinhardtUwe PartschLars RebenklauMarkus Eberstein
- The Effectiveness of Screening Techniques for Revealing Cracks in High Volumetric Efficiency MLCCsAlexander Teverovsky
- Assembly and Packaging Enabling System IntegrationKlaus PresselGottfried BeerMaciej Wojnowski
- Anti-Counterfeit, Advanced Microelectronics Packaging Solutions for Miniaturized Medical DevicesRabindra N. DasFrank D. EgittoHow Lin
- Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder jointHao ZhangQing-Sheng ZhuZhi-Quan LiuLi ZhangHongyan GuoChi-Ming Lai
- 3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric EfficiencyMichael VincentDoug MitchellJason WrightYap Weng FoongAlan MagnusZhiwei (Tony) GongScott HayesNavjot Chhabra
- Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging MaterialsMamadou Diobet DiopMarie-Claude PaquetDominique DrouinDavid Danovitch
- Non-Hermetic Micropackage for Chronic Implantable SystemsP. WangS.B. LachhmanD. SunS.J.A. MajerusM.S. DamaserC.A. ZormanP.X.-L. FengW.H. Ko
- Application of Low-k Liner for Stress and Capacitance Control in Cu-TSVC. S. TanL. ZhangH.Y. LiW. Yoo
- High and Moderate-Level Vacuum Packaging of Vibratory MEMSIgor P. PrikhodkoBrenton R. SimonGunjana SharmaSergei A. ZotovAlexander A. TrusovAndrei M. Shkel
- Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die PackageMichael LyakasCorey ReichmanMiguel JimarezRomina Mimi OcampoAaron ElbergAltaf HasanDierdre HaleFred HamiltonJoon Dong Kim
- Thermo-mechanical Stress of Underfilled 3D IC PackagingMing-Han WangMei-Ling Wu
- Moisture and Hydrogen Release in Optoelectronic Hermetic PackagesM. AlbarghoutiN. El DahdahG. PerosevicS. JainJ-M PapillonS. Fernandez
- Organic Chip Scale Package (CSP) Development for Flip Chip ApplicationsTomoyuki YamadaMasahiro FukuiKenji TeradaMasaaki HarazonoTeruya FujisakiCharles ReynoldsJean AudetYi PanScott MooreSushumna IruvantiHsichang LiuHongqing ZhangBrian Sundlof
- Evaluation of Epoxy Flux for Use in Hearing Aid SMD AssembliesSusie JohanssonJohn Dzarnoski
- Effect of ENEPIG Surface Finish on the Vibration Reliability of Solder InterconnectsSandeep MenonAdam PearlMichael OstermanMichael Pecht
- Thermal Cycling Reliability of Alternative Low-Silver Tin-based SoldersElviz GeorgeMichael OstermanMichael PechtRichard CoyleRichard ParkerElizabeth Benedetto
- Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technologyKoji SasakiNoritsuka Mizumura
- Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical EnvironmentJia-Shen LanMei-Ling Wu
- Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag AlloysYan LiuJoanna KeckErin PageNing-Cheng Lee
- Heat Sink Induced Thermo-Mechanical Joint Strain in QFN DevicesGerard McVickerVijay KhannaSri M. Sri-Jayantha
- Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC IntegrationJ. H. LauH. C. ChienS. T. WuY. L. ChaoW. C. LoM. J. Kao
- RF MEMS DPDT Switch Using Novel Simulated Seesaw DesignMohammed Al-AminSufian YousefBarry Morris
- Multi-layer PC boards Fabricated using Aerosol-jet PrintingJohn BolgerLeon LantzRich LewisRick TrudeauDaniel Hines
- An Overview of Isotropic Conductive Adhesives Filled with Metal-coated Polymer SpheresHoang-Vu NguyenKnut E. AasmundtveitHelge KristiansenTore Helland
- Size Matters – Embedding as an Enabler of Next-Generation SiPsNick Renaud-Bezot
- DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATIONG. ParèsA. AttardF. DosseulA. N'HariO. BoillonL. ToffaninG. KlugG. Simon
- A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POPMing HuLee KresgeNing-Cheng Lee
- Automated Wirepull Testing – Parallelogram of Forces-Real Time ApplicationRichard C. GarciaJosef Sedlmair (F&K Delvotec)
- Adhesion and Cure Mechanism Studies for Advanced Lidded Flip Chip ApplicationsLyndon J. LarsonKristen E. Steinbrecher
- Stacking of known good rebuilt wafers for high performance memory and SiPPascal CoudercJerome NoirayChristian Val
- Integrated Passive Devices and TSV, a disruptive technology for miniaturizationC. BunelJ-R. TenailleauF. VoironS. BorelA. Lefevre
- Flip-chip Packages with Periphery Cu Pillar Bumps as Wire Bond Replacement—Design, Modeling & CharacterizationZhe LiSiow Chek TanYee Huan YewPheak Ti TehMJ LeeJohn Xie
- Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bondingAstrid-Sofie B. VardøyH.J. van de WielStian MartinsenGreg R. HayesHartmut R. FischerKnut E. AasmundtveitAdriana LapadatuMaaike M. V. Taklo
- Small-chip Attachment on Copper Leadframe with Sintered Nanosilver PasteJesus N. CalataHanguang ZhengGuo-Quan LuKhai NgoLuu Nguyen
- Challenges of Adhesion Promotion for the Metallization of Glass InterposersSimon BambergMichael MerschyTobias BernhardFrank BrueningRobin TaylorLutz BrandtZhiming LiuHailuo FuSara Hunegnaw
- Cost Comparison of 2.5D/3D Packaging to other Packaging TechnologiesChet PaleskoAmy PaleskoE. Jan Vardaman
- Moisture Reliability Improvement of a High Performance Depletion Mode 0.15 um Gate PHEMT ProcessJon AbrokwahJohn StanbackJerry WangMolly JohnsonChi L. Jiaa
- Thermal Characteristic and Performance of the Glass Interposer with TGVs (Through-Glass Via)Heng-Chieh ChienChun-Hsien ChienMing-Ji DaiRa-Min TainWei-Chung LoYung-Jean Rachel Lu
- 3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End ElectronicsRabindra N. DasFrank D. EgittoSteven G. RosserErich KoppBarry BonitzRaj Rai
- LORD SolderBrace™ Wafer Applied Coating for Improved Reliability and Throughput in WLCSPGeorge SearsGuoyun TianDuy LeHeather Bradley
- Better, Faster and Cheaper Precision Cleaning: Advanced CO2 Cleaning TechnologyDavid Jackson
- Implementing Inductor Function with Vibrating Capacitor StructuresThomas F. MarinisJoseph W. Soucy
- Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding CompoundsK.-F. BeckerT. ThomasJ. BauerR. KahleT. BraunR. AschenbrennerM. Schneider-RamelowK.-D. Lang
- Compression molding solutions for various high end Package and Cost savings for standard Package applicationsMuneo Miura
- Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and MaterialsA. RezvaniM. MayerI. QinJ. BrunnerBob Chylak
- Modeling and Reliability Analysis of TSVs for High Frequency ApplicationsKaushal KannanBruce KimSukeshwar KannanSeok-Ho Noh
- Packaging Materials for 2.5/3D TechnologyBrian Schmaltz
- Analysis of stress/strain in Electroless Copper FilmsTobias BernhardSimon BambergFrank BrüningRalf BrüningLaurence J. GregoriadesTanu SharmaDelilah BrownM. KlausCh. Genzel
- Transferable Redistribution Layers (TRDL)Suzanne DunphyDavid Herndon
- Effect of Voiding in Solder Joints on Thermal Performance of the LEDJianbiao Pan
- A Study on the Effectiveness of Underfill in the High Bandwidth Memory with TSVWoong-Sun LeeDae-Woong LeeHo-Young SonJin-Su LeeMin-Suk SuhNick KimKwang-Yoo Byun
- Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold CompoundsVarughese MathewSheila ChopinLeo HigginsYingrui Zhang
- Modular Microsystems with Embedded ComponentsChristian BoehmeAndreas OstmannMartin Schneider-Ramelow
- Lithography Process Optimization for 3D and 2.5D ApplicationsDoug SheltonTomii Kume
- Conceptual Development Using 3D Printing Technologies for 8kV SiC Power Module PackageHaotao KeYang XuDouglas C Hopkins
- Silver oxalate: towards a new solder material for highly dissipative electronic assembliesK. KiryukhinaH. Le TrongP. TailhadesJ. LacazeM. GougeonV. BacoF. CourtadeS. DareysO. VendierL. Raynaud
- A STUDY ON PREVALENT FACTORS BEHIND EFFICIENCY DETERIORATION OF A TYPICAL LOW POWER SOLAR PANELV. GanescuA. Pascu
- Package design and development of a low cost high temperature (250°C), high current (50+A), low inductance discrete power package for advanced Silicon Carbide (SiC) and Gallium Nitride (GaN) devicesB. McPhersonB. PassmoreP. KilleenD. MartinA. BarkleyT. McNutt
- Integrated Ψ-Type Photonic Polarization Diversity Receivers for Wireless Radio-over-Fiber Communication LinksV. RymanovS. DülmeM. WachholzM. PalandökenT. TekinA. Stöhr
- Analysis of the Thick Film Deposited on Alumina Substrate and Effect of Different Parameters on the Response of Propanol Using Taguchi MethodIbrahim Gaidan
- A Low Loss Power Distribution Network Design in Low Temperature Co-fired Ceramic TechnologyMichael D. GloverMichael C. HamiltonEmmanuel DecrossasKaoru PorterAlexander PfeiffenbergerH. Alan Mantooth
- Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancementMustafa ÖzkökHubertus MertensJerome Bender
- Plating reliability and high frequency testing of DuPont™ GreenTape™ 9K7 LTCCAllan BeikmohamadiPatricia GraddyDeepukumar NairJim ParisiSteve Stewart
- Improving WLCSP Reliability Through Solder Joint Geometry OptimizationBoyd RogersChris Scanlan
- Precision Patterned Thin Films without Photolithography: Additive Manufacturing of Printed ElectronicsScott LauerWhitten LittleThomas AmbroseJeff ConradTim Cowen
- 3D Integrated Packaging Approach for High Performance Processor-Memory ModuleS. C. PolzerW. L. WilkinsJ. L. FasigM. J. DegerstromB. K. GilbertE. S. Daniel
- Thick Copper and Aluminum Wire Bonding Technology for High Power Laser DevicesKong Weng LeeLei XuJay Skidmore
- Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTu Anh TranVarughese MathewWen Shi KohK. Y. YowY. K. Au
- Multipurpose Wire Bonding – Bumps, Wires, Combination Interconnects, and Operation EfficiencyDaniel D. Evans
- Modeling of Failure in Aluminum Alloy Braze for a High Temperature Thermoelectric AssemblyS. ArifeenG. PotirnicheA. ElshabiniF. Barlow
- Improving System Performance with eGaN® FETs in DC-DC ApplicationsDavid ReuschJohan StrydomAlex Lidow
- Chip Design of an 1 V RF Receiver Front-End for 5.8-GHz DSRC ApplicationsJhin-Fang HuangWen Cheng LaiYong-Jhen Jiangn
- Characterization of CVD Diamond for Thermal Management ApplicationsR.S. BalmerB. BolligerJ.M. DodsonD.J. Twitchen
- Fully 3D Printed 2.4 GHz Bluetooth/Wi-Fi AntennaPaul DeffenbaughKenneth ChurchJosh GoldfarbXudong Chen
- Redistribution Layers (RDLs) for 2.5D/3D IC IntegrationJ. LauP. TzengC. LeeC. ZhanM. LiJ. ClineK. SaitoY. HsinP. ChangY. ChangJ. ChenS. ChenC. WuH. ChangC. ChienC. LinT. KuR. LoM. Kao
- Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Wiring Board Trace Widths in a VacuumBennion CannonFrank FriedlGary Gisler
- Advanced warpage characterization for FOWLPJorge TeixeiraMário RibeiroNélson Pinho
- Thermally and Electrically Enhanced Wirebond BGABurton CarpenterBoon Yew LowLeo M. HigginsSriram NeelakantanRobert WenzelDaniel Boyne
- A friction based approach for modeling wire bondingSimon AlthoffJan NeuhausTobias HemselWalter Sextro
- Integrated Current Sensing Technology for Synchronous Buck ConvertersEvan ReutzelRengang ChenScott RagonaDavid Jauregui
- 2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE.Yasuhiro MorikawaTakahide MurayamaToshiyuki SakuishiKoukou Suu
- RF Device Integration on Glass Interposer toward 3D-IPAC PackagesYoichiro SatoBruce ChouVijay SukumaranJunki MinMotoshi OnoChoukri KarouiFranck DosseulChristian NopperMadhavan SwaminathanVenky SundaramRao Tummala
- Five layer Cu-coated Zn/Al clad solder for die attachmentTakuto YamaguchiOsamu IkedaShohei HataYuichi OdaKazuma Kuroki
- Warpage Characterization and Improvements for IC Packages with Coreless SubstrateBora BalogluWei LinKen StrattonMiguel JimarezDanny Brady
- Scaling Challenges of Semiconductor Packaging in the Era of Big DataYasumitsu OriiAkihiro HoribeKazushige ToriyamaKeiji MatsumotoHirokazu NomaSayuri KoharaToyohiro AokiKuniaki SueokaHiroyuki Mori
- Detailed Analysis of How Power Stage and Power Clip Products Achieve Optimized Power DensityArthur Black
- Study of Wirebonding on Thin Al Pads with Various Size Probe MarksAndrew ForhanShashi SharmaPrakash SubediDustin WhittakerStevan Hunter
- Droplet-on-demand Inkjet-filled Through-silicon Vias (TSVs) as a Pathway to Cost-efficient Chip StackingJacob SadieNiels QuackMing C. WuVivek Subramanian
- Packaging of 1.3 Tb/s Full Duplex Optical InterconnectShuki BenjaminKobi HasharoniStanislav StepanovGideon KatzAmir GeronMichael Mesh
- Next-Generation Lead-Free Solder Plating Products for High Speed Bumping, Capping and Micro-Capping ApplicationsJonathan PrangeJulia WoertinkYi QinPedro Lopez MontesinosInho LeeYil-Hak LeeMasaaki ImanariJianwei DongJeffrey Calvert
- Advanced Devices and Electronic Packaging for Harsh EnvironmentAicha ElshabiniFred BarlowSharmin IslamPin-Jen Wang
- Effects of Copper Pattern Density and Orientation on the Modulus of BGA SubstratesBurton CarpenterBetty YeungYuan Yuan
- Source-Sense Packages for HV MOSFETsAnders Lind
- Development of TGV Interposer for 3D ICShintaro TakahashiKentaro TatsukoshiMotoshi OnoMasaki MikayamaNobuhiko Imajo
- Stencil Printing Process Guidelines for 0.3mm Pitch Chip Scale PackagesMark WhitmoreJeff SchakeClive Ashmore
- Advanced Thermal Simulation Model for Power MOSFETsJens Ejury
- A Highly Integrated GaAs-based Module for DC-DC RegulatorsGreg J. Miller
- A fully automated execution of complex DOE to characterize electroplating bathsNorbert SchroederFred RichterJuerg StahlArnold Cziurlok
- Monitoring of Wet Etch for Wafer Thinning and Via Reveal ProcessChuannan BaiEugene ShalytGuang LiangPeter Bratin
- Excimer Laser Machining of Fired LTCC for Selectively Metallized Open Channel StructuresDilshani Rathnayake-ArachchigeDavid A. HuttPaul P. Conway
- High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test StructureMin XuRobert GeerPavel KabosThomas Wallis
- Ultra-Thin Flexible Ceramic Membranes for Electronic ApplicationsJohn A. Olenick
- Electroless Ni plating solutions for reproducible black pad analyses.K.H. KimJin Yu
- Ultrasonically Enabled Low Temperature Electroless Plating for Advanced Electronic ManufactureA J CobleyJ E GravesA KassimB MkhlefB Abbas
Forhan, Andrew, Shashi Sharma, Prakash Subedi, Dustin Whittaker, and Stevan Hunter. 2013. “Study of Wirebonding on Thin Al Pads with Various Size Probe Marks.” IMAPSource Proceedings 2013 (1): 341–46. https://doi.org/10.4071/isom-2013-TP47.