ISSN 2380-4505
Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly Solution
Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly Solution
Liu, Mary, and Wusheng Yin. 2013. “Solder Joint Encapsulant Adhesive – LGA High Reliability And Low Cost Assembly Solution.” IMAPSource Proceedings 2013 (1): 291–97. https://doi.org/10.4071/isom-2013-TP35.