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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Compression molding solutions for various high end Package and Cost savings for standard Package applications

Muneo Miura,
compression molding2.5d3dmemssilicon chipshigh density ic packagesmold technology
https://doi.org/10.4071/isom-2013-WP57
IMAPSource Conference Papers
Miura, Muneo. 2013. “Compression Molding Solutions for Various High End Package and Cost Savings for Standard Package Applications.” IMAPSource Proceedings 2013 (1): 748–51. https:/​/​doi.org/​10.4071/​isom-2013-WP57.
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