ISSN 2380-4505
Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a Design
Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a Design
Tsai, Yi-Chuan, and Mei-Ling Wu. 2013. “Thermal Cycle Consideration in Applying Lead-Free TFBGA Simulation to a Design.” IMAPSource Proceedings 2013 (1): 140–46. https://doi.org/10.4071/isom-2013-TA47.