Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests
Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests
Elger, Gordon, Shri Vishnu Kandaswamy, Robert Derix, and Jürgen Wilde. 2013. “Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests.” IMAPSource Proceedings 2013 (1): 902–7. https://doi.org/10.4071/isom-2013-THP47.