ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards
Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards
Neal T. Pfeiffenberger, Saeid Biria,
Articles in Vol. 2021, Issue IMAPS Symposium, 2021
Vol. 2021, Issue IMAPS Symposium, 2021
- Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/HandlingRich RochfordCraig Blanchette
- Design Constraints and Scale Down Evolution in Advanced Semiconductor PackagesByong Jin KimSangHyeon LeeJaeBeom ShimNam-Hee ChoJinYoung Khim
- Throughput and Material Utilization by Glass Wafer Laser DicingAndreas S. GaabChristian J. WagnerPriyanka Khera
- MAXQFP: NXP's new package solution for automotive applicationChu-Chung Stephen LeeTu-Anh TranAndrew MawerXS PangJZ Yao
- Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environmentsK.-F. BeckerS. VogesP. FruehaufM. HeimannS. NerreterR. BlankM. ErdmannS. GottwaldA. HofmeisterM. HesseM. ThiesS. MehrafsunR. FustE. BeckJ. PawlikowskiB. SchröderC. VoightT. BraunM. Schneider-Ramelow
- Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturingStephen M. Rothrock
- Burn-in-Testing (BIT) Challenge: to BIT or not to BIT?E. Suhir
- Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level PackagingYoshinori MatsuuraTatsuya YoshidaYukiko KomiyaToshimi NakamuraTakenori YanaiKazuhiro OkuyamaYukiko KitabatakeRintaro IshiiKatsuyuki HayashiTakashi KubotaJoji Fujii
- Novel lithography technology for enhancing resolution limit at advanced packaging manufacturingHiroshi Matsui
- State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid BondingJohn H Lau
- Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materialsAlice GuerreroPieter BexAndrew M. JonesArthur SouthardDaojie DongAlain PhommahaxayEric Beyne
- Photonic Debonding for Wafer-Level PackagingVikram TurkaniVahid AkhavanKurt SchroderXiao LiuLuke PrengerXavier Martinez
- High-Accuracy Pick-and-Place of Multiple Dies in Parallel Assisted by Capillary Self-AlignmentBirgit BrandstätterBenedikt AuerHannes KlinglerSabine Scherbaum
- Fluxless Soldering in Activated Hydrogen AtmosphereGregory K. ArslanianRichard E. PatrickBruce XiangHerb Weigel
- Advanced Protected Fan-In WLCSPDoug HacklerEd Prack
- Lithography Solutions for Submicron Panel-Level PackagingDoug Shelton
- Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.M. LetzT. GotschkeF. WagnerM. Heiss-ChouquetL. MüllerU. PeuchertD. Vanderpool
- High UV Transmission Glass Carriers for Advanced PackagingJay ZhangIndy DuttaJulia BruecknerKatsumi BonoIncorporated Corning
- Latest technology of wafer coating material for advanced packagesRyuji HirosawaJunya Kusunoki
- Numerical simulation on the warpage of reconstructed wafer during encapsulation processHu ZhenZhao WeiGu XiaoChen DongChen HaijieXu HongKim Hwee Tan
- Alternative FCBGA Package Solution Evaluation: High-speed Design Optimization and Electrical Characterization of FOBGAHung-Hsiang ChengCheng-Yu WuHung-Chun KuoChen-Chao WangGuo-Cheng LiaoYun-Hsiang TienYi-Chuan Ding
- Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and UnderfillRicky Tsun-Sheng ChouJohn H LauGary Chang-Fu ChenJones Yu-Cheng HuangChanning Cheng-Lin YangHsing-Ning LiuTzyy-Jang Tseng
- Low Temperature Curable Low Dk & Df Polyimide for Antenna in PackageHitoshi ArakiAkira ShimadaHisashi OgasawaraMasaya JukeiTakenori FujiwaraMasao Tomikawa
- Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale PackagesMin-Yan TsaiYung-Sheng LinChin-Li KaoShan-Bo WangTing-Chun LinYun-Ching Hung
- The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced PackagingRalf SchmidtJens PalmJan M. Knaup
- Design of Coaxial TGV Substrates; Enhancing RF Via to Via IsolationTim LeClairSteve Martin
- High Frequency, Low Loss, Additively Manufactured Hermetic PackageTim SmithBill RhyneRobert ReidChristopher Hatfield
- New approach for High Reliable & Cost-Effective Solder alloys for Automotive ApplicationsSebastian FritzscheManu Noe VaidyaPeter PrenosilKatja StengerJörg TrodlerMichael Jörger
- Thin film flexible circuits with embedded ASICs–Enabling technology for sophisticated medical applicationsA. KaiserP. MatejK. HankaM. AbelC. HerbortR. LangO. PurscheK. RuessU. Keim
- Stabilized Sanathanan-Koerner Iteration for Rational Transfer Function Approximation of Scattering ParametersAndrew MaDaniel DeatonArif Ege Engin
- Design and Implementation of Harmonic RFID Based on Conventional UHF SystemAditya PurandareYihang ChuDeepak KumarSaikat MondalAndrew J. MasonPrem Chahal
- Fine-pitch Copper Pillar Flip Chips in High Reliability ApplicationsCatherine FarnumKaysar Rahim
- Additively Manufactured Extreme Temperature Electronics PackagingDavid ShaddockCathleen HoelNancy StoffelMark PoliksMohammed Alhendi
- An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects used in High Reliability ApplicationsAimee M MoreyScott PopelarJulie Hook
- Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICsTim SmithBill RhyneChristopher Hatfield
- Memory Packaging Challenges for a Growing MarketKnowlton OlmsteadCurtis ZwengerRichard Strode
- Warpage Simulation Study by Trace Mapping Method for FCCSP with ETS SubstrateKen ZhangNicholas KaoDavid LaiYu-Po Wang
- Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-LayerChia-Yu PengJohn H LauCheng-Ta KoPaul LeeEagle LinKai-Ming YangPuru Bruce LinTim XiaLeo ChangNing LiuCurry LinTzu Nien LeeJason WangMike MaTzyy-Jang Tseng
- A Substrate-less Process for Heterogeneous Integration of mm-Wave CircuitsCameron CrumpYihang ChuPremjeet Chahal
- Optimization of Thermal Design and Mold Flow Process for 3D SiP StructureYu-Hsiang ChangBing-Yuan HuangHung-Hsien HuangDao-Long ChenDavid TarngCP Hung
- High Density Package Design Platform and Assembly Design KitChih-Yi HuangLihong CaoKeng-Tuan ChangChen-Chao Wang
- Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP ApplicationB. Senthil KumarZhang Rui FenYam YamLip HueiZhang HanWenKang SungsigChan Li-San
- Impact of Bonding Sequence on Contact Resistance in Hybrid Bonding of Via-middle TSV WaferNaoya WatanabeHiroshi YamamotoTakahiko MitsuiEiichi Yamamoto
- JEDEC's Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire BondsCurtis Grosskopf
- Ultrasonic Wire Bond Outlier ClassificationHenri SeppänenSiang Tat ChuaJoel Elizondo MartinezPedro Villa
- Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module DesignUtkarsh MehrotraAdam J. MorganDouglas C. Hopkins
- Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL ArraysRainer DohleGerold HenningMaximilian WallrodtChristoph GréusChristian Neumeyr
- Comprehensive Characterization of All Inorganic and Organic Components in Neutral Tin Plating Bath for Electronics ApplicationsEugene ShalytJingjing WangVishal ParekhChuannan BaiGuang Liang
- Charactarization of Formaldehyde-Free Electro-Less Copper Plating for Semi-Additive ProcessMasaharu TakeuchiTomoharu NakayamaHisamitsu Yamamoto
- Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit BoardsNeal T. PfeiffenbergerSaeid Biria
- Contamination Troubleshooting for Microelectronics PackagingVictor K.F. ChiaTiffany WilkusLaarni HuertaWendy RivelloJennifer JewFuhe LiHugh GottsI-Hsiang HsuScott Anderson
- Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature FailureT. BernhardR. MasseyK. KlaedenS. ZarwellS. KempaE. SteinhaeuserS. DieterF. Brüning
- Emergence of Glass Solutions for 5G and Heterogeneous IntegrationAric B. ShoreyShelby F. NelsonDavid LevyPaul Ballentine
- Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modulesMotohiro NegishiTomoaki ShibataXinrong LiNaoya Suzuki
- Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against PrepregsKazue HiranoMasaya TobaMasaki Yamaguchi
- Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding AssemblyFred Fuliang LeHaibin ChenZunyu GuanFrancis Louise Fajardo
- Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfacesMichael WoodcoxManuel Smeu
- Distribution of Coated Metal Layer on Free Air Ball (FAB) SurfaceSarangapani MuraliLo Miew WanDhayalan MariyappanLim Yee Weon EvonneKang Sungsig SS
- Advanced bonding interface inspection technique for process optimization in heavy wire bondingStefan SchmitzNoritoshi ArakiMotoki EtoTadashi YamaguchiTeruo HaibaraTakashi Yamada
- Advanced wire bonding standards for European automotive and power electronics industryStefan SchmitzMartin Schneider-Ramelow
- Experimental parameter identification and validation of a process model for ultrasonic heavy wire bondingReinhard SchemmelNico MüllerLudger KlaholdTobias HemselWalter Sextro
- A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete ApplicationsHongwen ZhangSamuel LytwynecHuaguang WangJie GengFrancis MutukuNing-Cheng Lee
- Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous IntegrationEvan GriffithSze Pei Lim
- Understanding photoresist - electroplating bath interactions using HPLC methodologyI. PopovaR. DieckmannN. SchroederG. GomesJ. Golden
- Challenges and novel approaches for the development of hardware-related trustworthy electronicsA. MiddendorfM. BöttcherE. JungH. PötterI. NdipM. TöpperM. Schneider-RamelowW. Steller
- Thermal and Reliability Performance Comparison of DBC-Based and Organic-Based Double-Sided Cooled Power ModulesTzu-Hsuan ChengKenji NishiguchiYoshi FukawaDouglas C. Hopkins
- Highly accelerated lifetime testing in power electronicsBernhard CzernyGolta Khatibi
Pfeiffenberger, Neal T., and Saeid Biria. 2021. “Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards.” IMAPSource Proceedings 2021 (IMAPS Symposium): 281–85. https://doi.org/10.4071/1085-8024-2021.1.000281.