Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration
Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration
Evan Griffith, Sze Pei Lim,
Griffith, Evan, and Sze Pei Lim. 2021. “Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration.” IMAPSource Proceedings 2021 (IMAPS Symposium): 362–67. https://doi.org/10.4071/1085-8024-2021.1.000362.