Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Photonic Debonding for Wafer-Level Packaging
Photonic Debonding for Wafer-Level Packaging
Vikram Turkani, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, Xavier Martinez,
Turkani, Vikram, Vahid Akhavan, Kurt Schroder, Xiao Liu, Luke Prenger, and Xavier Martinez. 2021. “Photonic Debonding for Wafer-Level Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 67–73. https://doi.org/10.4071/1085-8024-2021.1.000067.