ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Fluxless Soldering in Activated Hydrogen Atmosphere
Fluxless Soldering in Activated Hydrogen Atmosphere
Gregory K. Arslanian, Richard E. Patrick, Bruce Xiang, Herb Weigel,
Articles in Vol. 2021, Issue IMAPS Symposium, 2021
Vol. 2021, Issue IMAPS Symposium, 2021
- Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/HandlingRich RochfordCraig Blanchette
- Design Constraints and Scale Down Evolution in Advanced Semiconductor PackagesByong Jin KimSangHyeon LeeJaeBeom ShimNam-Hee ChoJinYoung Khim
- Throughput and Material Utilization by Glass Wafer Laser DicingAndreas S. GaabChristian J. WagnerPriyanka Khera
- MAXQFP: NXP's new package solution for automotive applicationChu-Chung Stephen LeeTu-Anh TranAndrew MawerXS PangJZ Yao
- Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environmentsK.-F. BeckerS. VogesP. FruehaufM. HeimannS. NerreterR. BlankM. ErdmannS. GottwaldA. HofmeisterM. HesseM. ThiesS. MehrafsunR. FustE. BeckJ. PawlikowskiB. SchröderC. VoightT. BraunM. Schneider-Ramelow
- Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturingStephen M. Rothrock
- Burn-in-Testing (BIT) Challenge: to BIT or not to BIT?E. Suhir
- Fine Line and Low Stress RDL Solition for Fan-Out Wafer Level & Panel Level PackagingYoshinori MatsuuraTatsuya YoshidaYukiko KomiyaToshimi NakamuraTakenori YanaiKazuhiro OkuyamaYukiko KitabatakeRintaro IshiiKatsuyuki HayashiTakashi KubotaJoji Fujii
- Novel lithography technology for enhancing resolution limit at advanced packaging manufacturingHiroshi Matsui
- State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid BondingJohn H Lau
- Prevention of thinned wafer deformation during thermocompression bonding and multi-die stacking supported by temporary bonding materialsAlice GuerreroPieter BexAndrew M. JonesArthur SouthardDaojie DongAlain PhommahaxayEric Beyne
- Photonic Debonding for Wafer-Level PackagingVikram TurkaniVahid AkhavanKurt SchroderXiao LiuLuke PrengerXavier Martinez
- High-Accuracy Pick-and-Place of Multiple Dies in Parallel Assisted by Capillary Self-AlignmentBirgit BrandstätterBenedikt AuerHannes KlinglerSabine Scherbaum
- Fluxless Soldering in Activated Hydrogen AtmosphereGregory K. ArslanianRichard E. PatrickBruce XiangHerb Weigel
- Advanced Protected Fan-In WLCSPDoug HacklerEd Prack
- Lithography Solutions for Submicron Panel-Level PackagingDoug Shelton
- Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.M. LetzT. GotschkeF. WagnerM. Heiss-ChouquetL. MüllerU. PeuchertD. Vanderpool
- High UV Transmission Glass Carriers for Advanced PackagingJay ZhangIndy DuttaJulia BruecknerKatsumi BonoIncorporated Corning
- Latest technology of wafer coating material for advanced packagesRyuji HirosawaJunya Kusunoki
- Numerical simulation on the warpage of reconstructed wafer during encapsulation processHu ZhenZhao WeiGu XiaoChen DongChen HaijieXu HongKim Hwee Tan
- Alternative FCBGA Package Solution Evaluation: High-speed Design Optimization and Electrical Characterization of FOBGAHung-Hsiang ChengCheng-Yu WuHung-Chun KuoChen-Chao WangGuo-Cheng LiaoYun-Hsiang TienYi-Chuan Ding
- Reliability of Chiplets Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and UnderfillRicky Tsun-Sheng ChouJohn H LauGary Chang-Fu ChenJones Yu-Cheng HuangChanning Cheng-Lin YangHsing-Ning LiuTzyy-Jang Tseng
- Low Temperature Curable Low Dk & Df Polyimide for Antenna in PackageHitoshi ArakiAkira ShimadaHisashi OgasawaraMasaya JukeiTakenori FujiwaraMasao Tomikawa
- Effect of Novel SAC-Bi Solder Joints on Electromigration Reliability for Wafer Level Chip Scale PackagesMin-Yan TsaiYung-Sheng LinChin-Li KaoShan-Bo WangTing-Chun LinYun-Ching Hung
- The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced PackagingRalf SchmidtJens PalmJan M. Knaup
- Design of Coaxial TGV Substrates; Enhancing RF Via to Via IsolationTim LeClairSteve Martin
- High Frequency, Low Loss, Additively Manufactured Hermetic PackageTim SmithBill RhyneRobert ReidChristopher Hatfield
- New approach for High Reliable & Cost-Effective Solder alloys for Automotive ApplicationsSebastian FritzscheManu Noe VaidyaPeter PrenosilKatja StengerJörg TrodlerMichael Jörger
- Thin film flexible circuits with embedded ASICs–Enabling technology for sophisticated medical applicationsA. KaiserP. MatejK. HankaM. AbelC. HerbortR. LangO. PurscheK. RuessU. Keim
- Stabilized Sanathanan-Koerner Iteration for Rational Transfer Function Approximation of Scattering ParametersAndrew MaDaniel DeatonArif Ege Engin
- Design and Implementation of Harmonic RFID Based on Conventional UHF SystemAditya PurandareYihang ChuDeepak KumarSaikat MondalAndrew J. MasonPrem Chahal
- Fine-pitch Copper Pillar Flip Chips in High Reliability ApplicationsCatherine FarnumKaysar Rahim
- Additively Manufactured Extreme Temperature Electronics PackagingDavid ShaddockCathleen HoelNancy StoffelMark PoliksMohammed Alhendi
- An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects used in High Reliability ApplicationsAimee M MoreyScott PopelarJulie Hook
- Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICsTim SmithBill RhyneChristopher Hatfield
- Memory Packaging Challenges for a Growing MarketKnowlton OlmsteadCurtis ZwengerRichard Strode
- Warpage Simulation Study by Trace Mapping Method for FCCSP with ETS SubstrateKen ZhangNicholas KaoDavid LaiYu-Po Wang
- Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-LayerChia-Yu PengJohn H LauCheng-Ta KoPaul LeeEagle LinKai-Ming YangPuru Bruce LinTim XiaLeo ChangNing LiuCurry LinTzu Nien LeeJason WangMike MaTzyy-Jang Tseng
- A Substrate-less Process for Heterogeneous Integration of mm-Wave CircuitsCameron CrumpYihang ChuPremjeet Chahal
- Optimization of Thermal Design and Mold Flow Process for 3D SiP StructureYu-Hsiang ChangBing-Yuan HuangHung-Hsien HuangDao-Long ChenDavid TarngCP Hung
- High Density Package Design Platform and Assembly Design KitChih-Yi HuangLihong CaoKeng-Tuan ChangChen-Chao Wang
- Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP ApplicationB. Senthil KumarZhang Rui FenYam YamLip HueiZhang HanWenKang SungsigChan Li-San
- Impact of Bonding Sequence on Contact Resistance in Hybrid Bonding of Via-middle TSV WaferNaoya WatanabeHiroshi YamamotoTakahiko MitsuiEiichi Yamamoto
- JEDEC's Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire BondsCurtis Grosskopf
- Ultrasonic Wire Bond Outlier ClassificationHenri SeppänenSiang Tat ChuaJoel Elizondo MartinezPedro Villa
- Optimization of Al Heavy Wire Bonds Bond profile in WBG Power Module DesignUtkarsh MehrotraAdam J. MorganDouglas C. Hopkins
- Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL ArraysRainer DohleGerold HenningMaximilian WallrodtChristoph GréusChristian Neumeyr
- Comprehensive Characterization of All Inorganic and Organic Components in Neutral Tin Plating Bath for Electronics ApplicationsEugene ShalytJingjing WangVishal ParekhChuannan BaiGuang Liang
- Charactarization of Formaldehyde-Free Electro-Less Copper Plating for Semi-Additive ProcessMasaharu TakeuchiTomoharu NakayamaHisamitsu Yamamoto
- Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit BoardsNeal T. PfeiffenbergerSaeid Biria
- Contamination Troubleshooting for Microelectronics PackagingVictor K.F. ChiaTiffany WilkusLaarni HuertaWendy RivelloJennifer JewFuhe LiHugh GottsI-Hsiang HsuScott Anderson
- Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature FailureT. BernhardR. MasseyK. KlaedenS. ZarwellS. KempaE. SteinhaeuserS. DieterF. Brüning
- Emergence of Glass Solutions for 5G and Heterogeneous IntegrationAric B. ShoreyShelby F. NelsonDavid LevyPaul Ballentine
- Verification of Compartmental Electromagnetic Interference Shielding Effect with imprint-Through Mold Via (i-TMV) for RF modulesMotohiro NegishiTomoaki ShibataXinrong LiNaoya Suzuki
- Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against PrepregsKazue HiranoMasaya TobaMasaki Yamaguchi
- Assessment of Solder Flux Corrosivity and Flux Residue Level in Clip Bonding AssemblyFred Fuliang LeHaibin ChenZunyu GuanFrancis Louise Fajardo
- Atomistic modeling to predict and improve the strength of doped Sn-Cu solder interfacesMichael WoodcoxManuel Smeu
- Distribution of Coated Metal Layer on Free Air Ball (FAB) SurfaceSarangapani MuraliLo Miew WanDhayalan MariyappanLim Yee Weon EvonneKang Sungsig SS
- Advanced bonding interface inspection technique for process optimization in heavy wire bondingStefan SchmitzNoritoshi ArakiMotoki EtoTadashi YamaguchiTeruo HaibaraTakashi Yamada
- Advanced wire bonding standards for European automotive and power electronics industryStefan SchmitzMartin Schneider-Ramelow
- Experimental parameter identification and validation of a process model for ultrasonic heavy wire bondingReinhard SchemmelNico MüllerLudger KlaholdTobias HemselWalter Sextro
- A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete ApplicationsHongwen ZhangSamuel LytwynecHuaguang WangJie GengFrancis MutukuNing-Cheng Lee
- Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous IntegrationEvan GriffithSze Pei Lim
- Understanding photoresist - electroplating bath interactions using HPLC methodologyI. PopovaR. DieckmannN. SchroederG. GomesJ. Golden
- Challenges and novel approaches for the development of hardware-related trustworthy electronicsA. MiddendorfM. BöttcherE. JungH. PötterI. NdipM. TöpperM. Schneider-RamelowW. Steller
- Thermal and Reliability Performance Comparison of DBC-Based and Organic-Based Double-Sided Cooled Power ModulesTzu-Hsuan ChengKenji NishiguchiYoshi FukawaDouglas C. Hopkins
- Highly accelerated lifetime testing in power electronicsBernhard CzernyGolta Khatibi
Arslanian, Gregory K., Richard E. Patrick, Bruce Xiang, and Herb Weigel. 2021. “Fluxless Soldering in Activated Hydrogen Atmosphere.” IMAPSource Proceedings 2021 (IMAPS Symposium): 80–88. https://doi.org/10.4071/1085-8024-2021.1.000080.