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ISSN 2380-4505
General
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT

High UV Transmission Glass Carriers for Advanced Packaging

Jay Zhang, Indy Dutta, Julia Brueckner, Katsumi Bono, Incorporated Corning,
Temporary bondingglass carrier waferUV transmissionwafer thinning
https://doi.org/10.4071/1085-8024-2021.1.000103
IMAPSource Conference Papers
Zhang, Jay, Indy Dutta, Julia Brueckner, Katsumi Bono, and Incorporated Corning. 2021. “High UV Transmission Glass Carriers for Advanced Packaging.” IMAPSource Proceedings 2021 (IMAPS Symposium): 103–7. https:/​/​doi.org/​10.4071/​1085-8024-2021.1.000103.

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