ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects used in High Reliability Applications
An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects used in High Reliability Applications
Aimee M Morey, Scott Popelar, Julie Hook,
Morey, Aimee M, Scott Popelar, and Julie Hook. 2021. “An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High Reliability Applications.” IMAPSource Proceedings 2021 (IMAPS Symposium): 195–200. https://doi.org/10.4071/1085-8024-2021.1.000195.