Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Impact of Bonding Sequence on Contact Resistance in Hybrid Bonding of Via-middle TSV Wafer
Impact of Bonding Sequence on Contact Resistance in Hybrid Bonding of Via-middle TSV Wafer
Naoya Watanabe, Hiroshi Yamamoto, Takahiko Mitsui, Eiichi Yamamoto,
Watanabe, Naoya, Hiroshi Yamamoto, Takahiko Mitsui, and Eiichi Yamamoto. 2021. “Impact of Bonding Sequence on Contact Resistance in Hybrid Bonding of Via-Middle TSV Wafer.” IMAPSource Proceedings 2021 (IMAPS Symposium): 244–48. https://doi.org/10.4071/1085-8024-2021.1.000244.