ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure
Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure
Yu-Hsiang Chang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, David Tarng, CP Hung,
Chang, Yu-Hsiang, Bing-Yuan Huang, Hung-Hsien Huang, Dao-Long Chen, David Tarng, and CP Hung. 2021. “Optimization of Thermal Design and Mold Flow Process for 3D SiP Structure.” IMAPSource Proceedings 2021 (IMAPS Symposium): 228–33. https://doi.org/10.4071/1085-8024-2021.1.000228.