Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Ultrasonic Wire Bond Outlier Classification
Ultrasonic Wire Bond Outlier Classification
Henri Seppänen, Siang Tat Chua, Joel Elizondo Martinez, Pedro Villa,
Seppänen, Henri, Siang Tat Chua, Joel Elizondo Martinez, and Pedro Villa. 2021. “Ultrasonic Wire Bond Outlier Classification.” IMAPSource Proceedings 2021 (IMAPS Symposium): 256–59. https://doi.org/10.4071/1085-8024-2021.1.000256.