Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.
Structured glass substrates in wafer- and panel level packaging: Status and recent achievements.
M. Letz, T. Gotschke, F. Wagner, M. Heiss-Chouquet, L. Müller, U. Peuchert, D. Vanderpool,
Letz, M., T. Gotschke, F. Wagner, M. Heiss-Chouquet, L. Müller, U. Peuchert, and D. Vanderpool. 2021. “Structured Glass Substrates in Wafer- and Panel Level Packaging: Status and Recent Achievements.” IMAPSource Proceedings 2021 (IMAPS Symposium): 98–102. https://doi.org/10.4071/1085-8024-2021.1.000098.