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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Robust Reliability Performance of Large size eWLB (Fan-out WLP)
Seung Wook Yoon
,
eWLB
Reliability
Fanout WLCSP
•
https://doi.org/10.4071/2013DPC-wp21
IMAPSource Conference Papers
Yoon, Seung Wook. 2013. “Robust Reliability Performance of Large Size eWLB (Fan-out WLP).”
IMAPSource Proceedings
2013 (DPC): 1438–57.
https://doi.org/10.4071/2013DPC-wp21
.
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