Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Adopt Advanced RDL Rule to Apply Flip Chip Technology for Next Generation Si Node: Feasibility Study
Adopt Advanced RDL Rule to Apply Flip Chip Technology for Next Generation Si Node: Feasibility Study
Shengmin Wen, KyungRok Park, Patrick Thompson, JeongSeok Lee, HyunJin Park,
Wen, Shengmin, KyungRok Park, Patrick Thompson, JeongSeok Lee, and HyunJin Park. 2013. “Adopt Advanced RDL Rule to Apply Flip Chip Technology for Next Generation Si Node: Feasibility Study.” IMAPSource Proceedings 2013 (DPC): 1–11. https://doi.org/10.4071/2013DPC-wa23.