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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 mm to 300 mm

Andre Cardoso, Rui Almeida, Felandorio Fernandes, Ted Tessier, Anthony Curtis,
WLCSPFan inSpheron
https://doi.org/10.4071/2013DPC-ta24
IMAPSource Conference Papers
Cardoso, Andre, Rui Almeida, Felandorio Fernandes, Ted Tessier, and Anthony Curtis. 2013. “Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 Mm to 300 Mm.” IMAPSource Proceedings 2013 (DPC): 471–94. https:/​/​doi.org/​10.4071/​2013DPC-ta24.
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