Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Strain in Electroless Copper Films: Analysis by in situ X-Ray Diffraction and Curvature Methods
Strain in Electroless Copper Films: Analysis by in situ X-Ray Diffraction and Curvature Methods
Simon Bamberg, Tobias Bernhard (corresponding author), Laurence J. Gregoriades (presenting author), Frank Brüning, Ralf Brüning, Johannes Etzkorn, Wolfgang Friz, Michael Merschky, Bruce Muir, Laura K. Perry, Tanu Sharma,
Bamberg, Simon, Tobias Bernhard (corresponding author), Laurence J. Gregoriades (presenting author), Frank Brüning, Ralf Brüning, Johannes Etzkorn, Wolfgang Friz, et al. 2013. “Strain in Electroless Copper Films: Analysis by in Situ X-Ray Diffraction and Curvature Methods.” IMAPSource Proceedings 2013 (DPC): 1358–88. https://doi.org/10.4071/2013DPC-wp14.