ISSN 2380-4505
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCMBGA)
Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCMBGA)
Bora Baloglu, Miguel Jimarez, Ahmer Syed,
Baloglu, Bora, Miguel Jimarez, and Ahmer Syed. 2013. “Groove Geometry and Mold Shrinkage Effects on Die Stress in Flip Chip Molded BGAs (FCMBGA).” IMAPSource Proceedings 2013 (DPC): 455–70. https://doi.org/10.4071/2013DPC-ta23.