Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Electrografted insulator layer as copper diffusion barrier for TSV interposers
Electrografted insulator layer as copper diffusion barrier for TSV interposers
Vincent Mevellec, Dominique Suhr, Thomas Dequivre, Frédérique Raynal,
Mevellec, Vincent, Dominique Suhr, Thomas Dequivre, and Frédérique Raynal. 2013. “Electrografted Insulator Layer as Copper Diffusion Barrier for TSV Interposers.” IMAPSource Proceedings 2013 (DPC): 1051–84. https://doi.org/10.4071/2013DPC-wa14.