Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Lead Free Paste with under 3um Solder Particles for Fine Pitch C4 bumping and pre-coating solder applications
Lead Free Paste with under 3um Solder Particles for Fine Pitch C4 bumping and pre-coating solder applications
Hironori Uno, Masayuki Ishikawa, Akihiro Masuda, Hiroki Muraoka, Kanji Kuba,
Uno, Hironori, Masayuki Ishikawa, Akihiro Masuda, Hiroki Muraoka, and Kanji Kuba. 2013. “Lead Free Paste with under 3um Solder Particles for Fine Pitch C4 Bumping and Pre-Coating Solder Applications.” IMAPSource Proceedings 2013 (DPC): 862–89. https://doi.org/10.4071/2013DPC-tp25.