Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts
A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts
Wei Lin, Ahmer Syed, KiWook Lee, Karthikeyan Dhandapani,
Lin, Wei, Ahmer Syed, KiWook Lee, and Karthikeyan Dhandapani. 2013. “A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts.” IMAPSource Proceedings 2013 (DPC): 1603–21. https://doi.org/10.4071/2013DPC-wp31.