Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
3D Ics with Embedded Microfluidic Cooling and High Aspect Ratio TSV Integration
3D Ics with Embedded Microfluidic Cooling and High Aspect Ratio TSV Integration
Paragkumar Thadesar, Muhannad S. Bakir,
Thadesar, Paragkumar, and Muhannad S. Bakir. 2013. “3D Ics with Embedded Microfluidic Cooling and High Aspect Ratio TSV Integration.” IMAPSource Proceedings 2013 (DPC): 1744–68. https://doi.org/10.4071/2013DPC-wp36.