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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Integration of Passive Components into 3D PoP Fan-Out Packages
Tom Strothmann
,
Passive Components
3D PoP
Fan-out
•
https://doi.org/10.4071/2013DPC-wp26
IMAPSource Conference Papers
Strothmann, Tom. 2013. “Integration of Passive Components into 3D PoP Fan-Out Packages.”
IMAPSource Proceedings
2013 (DPC): 1585–1602.
https://doi.org/10.4071/2013DPC-wp26
.
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