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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Micromachined High Density Embedded Capacitor Technologies for Silicon Interposers

Aubrey Beal, T. Baginski, R. Dean, M. Hamilton,
Embedded Capacitor Micro-machining Silicon Interposer
• https://doi.org/10.4071/2012DPC-tp42
IMAPSource Conference Papers
Beal, Aubrey, T. Baginski, R. Dean, and M. Hamilton. 2012. “Micromachined High Density Embedded Capacitor Technologies for Silicon Interposers.” IMAPSource Proceedings 2012 (DPC): 1192–1222. https://doi.org/10.4071/2012DPC-tp42.
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