ISSN 2380-4505
Articles in Vol. 2012, Issue DPC, 2012
Vol. 2012, Issue DPC, 2012
- Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh EnvironmentsDavid FriesGeran BartonGary HendricksBrian GregsonLiesl Hotaling
- Micromachined Snap-In ResonatorsColin StevensRobert DeanChris Wilson
- Comparative Test Data for TIM Materials for LED ApplicationsVictor Papanu
- IC Package Route Planning Methodology Designs Better ProductsWilliam AcitoHarry McCaleb
- Enabling Packaging Houses to Achieve 3D Integration without InterposersJeff LealMarc RobinsonSuzette Pangrle
- Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging SolutionSeung Wook YoonYaojian LinYonggang JinJerome TeysseyreXavier BaratonPandi C. Marimuthu
- Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect TechnologiesRobert Darveaux
- 200mm & 300mm Processes & Characterization for Face to Back Flow Chart for Wide I/OSeverine CheramyG. GarnierA. JouveJ.-P. ColonnaP. CoudrainP. ChausseR. SegaudC. AumontN. HotellierC. Brunet-ManquatC. LavironN. Sillon
- Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and PrototypingBrian J. LewisDaniel F. BaldwinPaul N. HoustonLe hang LaTim Spark
- A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC StructuresKarthikeyan DhandapaniAhmer SyedWei LinMark NakamotoWei ZhaoRiko Radojcic
- Low Temperature Direct Aluminum Soldering PasteWilliam F. Avery
- Room Temperature Debonding - An Enabling Technology for TSV and 3D IntegrationThorsten MatthiasEric PaboJuergen BurggrafDaniel BurgstallerMarkus WimplingerPaul Lindner
- 3D Integration of RF PackageKai LiuYongTaek LeeHyunTai KimGwang KimBilly Ahn
- NCP (Non Conductive Paste) for Narrow Gap Flip Chip Package and TSV PackageHidenori AbeTomoya MasudaYuko KondoHiroshi Takahashi
- ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal PerformanceSenthil SivaswamyTheodore (Ted) G. TessierTony CurtisDavid ClarkKazuhisa ItoiMasahiro OkamotoYoshinori SanoNobuyuki UetaSatoshi OkudeOsamu Nakao
- Low-Cost Adhesives for Temporary Substrate SupportJohn MooreJared Pettit
- Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive PolymersMichael GallagherJong-Uk KimEric HuengerKai ZoschkeChristina LopperMichael Toepper
- Predicting the Reliability of Zero-Level TSVsGreg CaswellCraig Hillman
- Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)Eric HuengerJoe LachowskiGreg ProkopowiczRay ThibaultMichael GallagherScott KistingLynne MillsMasaki Kondoh
- Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped DieGilbert LecarpentierJoeri De Vos
- Temporary Wafer Bonding Materials and ProcessesMatthew LueckAlan HuffmanMarianne ButlerDorota TemplePhil Garrou
- Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing PhenomenonD. Saint-PatriceJ. L. PorninB. SavorninG. RodriguezS. DanthonP. L. CharvetP. NicolasS. NicolasS. Fanget
- TSV Market Drivers, Demand & Product ReadinessRon Huemoeller
- MEMS Tornado to Challenge Next Generation PackagingJanusz Bryzek
- Ultra-Slim PackagesBernd K. Appelt
- Post-Packaged Measurement of MEMS Gap, Displacement, Force, Stiffness, Mass, Damping, and Quality FactorJason Vaughn Clark
- Laddered-UBM Structure: Bump Reliability Improvement through Distribution of Load Concentration PointsRoden Topacio
- 3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSVRao Tummala
- Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder PasteMasayuki IshikawaHironori UnoTakashi YamajiRyuji UesugiAkihiro MasudaShingo HiranoFuyumi MawatariNatsuko TanakaKohki Okada
- Studies and Applications of Advanced Laser Scribing for High Brightness LEDsIrving ChyrCheng PengJi WangJonathan Halderman
- TGV Microfabrication Technology for 3D PackagingShintaro TakahashiChristian SchmidtLeander DittmannSvend HoyerAdrien ChaizeMotoshi OnoKenji KitaokaKentaro TatsukoshiShoichi Konishi
- Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS ApplicationsLars G. W. TvedtNicolas LietaerThor BakkeKeith RedfordHelge Kristiansen
- 3D & System-in-Package Development with the Redistributed Chip Package (RCP)Zhiwei (Tony) GongScott HayesNavjot ChhabraTrung DuongDoug MitchellJason WrightMichael Vincent
- Assembly Challenges for Large Interposer 2.5D TSV ProductsMarnie MatteiMike Kelly
- Development of Substrates for Through Glass ViasAric ShoreyScott Pollard
- Passive Flexible-Substrate Blast Sensor ArrayStephen M. PhillipsDavid R. AlleeNarendra Lakamraju
- Ultra High 3D Capacitors Values with High Volume Efficiency and Outstanding StabilityCatherine BunelFranck Murray
- Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency ApplicationsTim MobleyVern Stygar
- Simulating Atomic-Scale Defects with Atomic Methods and Extended Finite ElementsJay Oswald
- Performance of MEMS Vibratory Gyroscope under Harsh EnvironmentsChandradip PatelPatrick McCluskey
- MEMS Based Transducer Designs for Monitoring High Speed ImpactsPhilip ReinerArthur JenkinsSharon SanchezTracy D. HudsonMichael Kranz
- Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab TechnologyMark A. BachmanJerry LiaoJohn OsenbachZafer KutluJaeyun GimDanny Brady
- High Density Attachment of HB-LED Die to Heat Sink Surfaces Using Aerosol Jet PrintingKurt K. ChristensonMichael J. RennJason A. PaulsenJustin J. BourassaKelley M. McDonald
- Plating Opportunities in 3DAlbrecht UhligHolger BeraCornelia JaegerDirk Rohde
- Testing of Flexible Metamaterial RF Filters Implemented through Micromachining LCP SubstratesRobert DeanJonathan Richard
- Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu SubstratesRussell StapletonJim Greig
- Flexible Electronics Fabrication for Missile Wiring InterconnectsMichael R. WhitleyTracy D. Hudson
- Modeling and Simulation of 3D MEMS Integrated RF CircuitsBruce KimSukeshwar KannanAnurag GuptaNaga Sai Evana
- Temperature Cycling Induced Warpage of Packages with Embedded Copper HeatspreadersMatthew StahleyJohn OsenbachBrenda GogueByong Il HeoByung Cheol LeeDongmei Meng
- The Reactive Bridge: A Novel Solid-State Low Energy InitiatorThomas A. BaginskiRobert N. Dean
- Hybrid Bonding Methods Using Ultra Precision Cutting for 3D-SICTaiji SakaiNobuhiro ImaizumiMasataka MizukoshiMasayuki KawaseRyoji TanimotoTakashi MoriKohei TakedaToshio Enami
- Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip StackingAnupam ChoubeyE. AnzuresA. DhobleD. FlemingM. GallagherI. LeeM. OliverY. QinC. TruongZ. WangJ. Woertink
- Gold Stud Bump on Sn Based SoldersTerence Q. Collier
- 3D Packaging Solution Providing DDR & LPDDR Co-Support for Ultrabooks and Next Generation ServersSimon McElreaVern Solberg
- Active and Passive Devices Embedded in Laminate-Based Multilayer BoardSatoshi OkudeKazushisa ItoiMasahiro OkamotoNobuki UetaOsamu Nakao
- Embedded Chip Technology: Technologies, Applications and Future DevelopmentsLars BoettcherS. KaraszkiewiczD. ManessisA. Ostmann
- Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging ApplicationsJeb FlemmingRoger CookKevin DunnJames Gouker
- Improvement of Plated Copper Adhesion in Glass Interposer ApplicationsSimon BambergVijay SukumaranVenky SundaramRao TummalaJohannes EtzkornFrank Brüning
- Super Fine Lead-Free Solder Powder for Fine Pitch Bump ApplicationsRyuji UesugiHironori UnoMasayuki IshikawaAkihiro MasudaHiroki MuraokaYousuke KawamuraSho NakagawaKanji Kuba
- Thermal Reliability for LED Lighting DesignJustin KolbeSanjay Misra
- Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D IntegrationEric F. PaboViorel DragoiTian TangThorsten Matthias
- Thermal Cycling Analysis of BGA Solder Joint ReliabilityBetty H. YeungTorsten HauckBrett WilkersonThomas Koschmieder
- Micromachined High Density Embedded Capacitor Technologies for Silicon InterposersAubrey BealT. BaginskiR. DeanM. Hamilton
- Silicon Interposer Creation Using Innovative Ultra-Thin Wafer Handling SolutionsAmandine JouveG. GarnierE. DezandreM. PellatK. VialS. CheramyJ-P. ColonnaR. Sandeacutegaud gaudN. SillonR. PuligaddaJ. McCutcheon
- Development of Electronic Substrates for Medical Device ApplicationsFrank D. EgittoRabindra N. DasFrancesco MarconiBill WilsonVoya R. Markovich
- Thermal Challenges in 3D StacksSusheela NarasimhanHerman ChuMudasir AhmadLi Li
- High-Aspect Ratio Planarization using Self-Leveling MaterialsMichelle FowlerDongshun BaiCurt PlanjeXie Shao
- The Evolution of LED Packaging: New Approaches for Solid State LightingRobert F. Karlicek
- 2.5D and 3D Packaging Enables Effective Multi-Chip PackagingPhil Marcoux
- Proven Cleaning Technology Solutions for Lead-Free Micro-Bumping ProcessesKimberly D. PollardNichelle GilbertDon PfettscherSpencer Hochstetler
- Low-Temperature Indium Bonding for MEMS DevicesDaniel HarrisRobert DeanAshish PalkarMike PalmerCharles EllisGary Wonacott
- Polymer-Based Hermetic Packaging for Flexible Micro DevicesLi-Anne LiewChing-Yi LinY. C. Lee
- Silicon Wafer Thinning to Reveal Cu TSVLaura MauerJohn TaddeiRamey Youssef
- In-Coated Carbon Nanotubes for Flexible InterconnectsPingye XuMichael C. Hamilton
- Laser Processing and Integration for Si Interposers and 3D Packaging ApplicationsMatthew KnowlesAndy HooperKip Pettigrew
- Development of Lead Free Plating Chemical for Various ApplicationsTakeshi HattaAtsushi IshikawaTakuma KataseAkihiro Masuda
- New Advances in 3D/2.5D IntegrationRobert Patti
- Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board ApplicationsRavi M. BhatkalRanjit PandherAnna LiftonPaul KoepHafez Raeisi Fard
Collier, Terence Q. 2012. “Gold Stud Bump on Sn Based Solders.” IMAPSource Proceedings 2012 (DPC): 1870–94. https://doi.org/10.4071/2012DPC-wp24.