Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Post-Packaged Measurement of MEMS Gap, Displacement, Force, Stiffness, Mass, Damping, and Quality Factor
Post-Packaged Measurement of MEMS Gap, Displacement, Force, Stiffness, Mass, Damping, and Quality Factor
Jason Vaughn Clark,
Clark, Jason Vaughn. 2012. “Post-Packaged Measurement of MEMS Gap, Displacement, Force, Stiffness, Mass, Damping, and Quality Factor.” IMAPSource Proceedings 2012 (DPC): 1936–81. https://doi.org/10.4071/2012DPC-wp32.