ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Silicon Interposer Creation Using Innovative Ultra-Thin Wafer Handling Solutions
Silicon Interposer Creation Using Innovative Ultra-Thin Wafer Handling Solutions
Amandine Jouve, G. Garnier, E. Dezandre, M. Pellat, K. Vial, S. Cheramy, J-P. Colonna, R. Sandeacute, gaud gaud, N. Sillon, R. Puligadda, J. McCutcheon,
Jouve, Amandine, G. Garnier, E. Dezandre, M. Pellat, K. Vial, S. Cheramy, J-P. Colonna, et al. 2012. “Silicon Interposer Creation Using Innovative Ultra-Thin Wafer Handling Solutions.” IMAPSource Proceedings 2012 (DPC): 846–92. https://doi.org/10.4071/2012DPC-tp15.