ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Comparative Test Data for TIM Materials for LED Applications
Comparative Test Data for TIM Materials for LED Applications
Victor Papanu,
Articles in Vol. 2012, Issue DPC, 2012
Vol. 2012, Issue DPC, 2012
- Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh EnvironmentsDavid FriesGeran BartonGary HendricksBrian GregsonLiesl Hotaling
- Micromachined Snap-In ResonatorsColin StevensRobert DeanChris Wilson
- Comparative Test Data for TIM Materials for LED ApplicationsVictor Papanu
- IC Package Route Planning Methodology Designs Better ProductsWilliam AcitoHarry McCaleb
- Enabling Packaging Houses to Achieve 3D Integration without InterposersJeff LealMarc RobinsonSuzette Pangrle
- Next Generation eWLB (Embedded Wafer Level BGA): Advanced 3D SiP Packaging SolutionSeung Wook YoonYaojian LinYonggang JinJerome TeysseyreXavier BaratonPandi C. Marimuthu
- Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect TechnologiesRobert Darveaux
- 200mm & 300mm Processes & Characterization for Face to Back Flow Chart for Wide I/OSeverine CheramyG. GarnierA. JouveJ.-P. ColonnaP. CoudrainP. ChausseR. SegaudC. AumontN. HotellierC. Brunet-ManquatC. LavironN. Sillon
- Processing, Bumping and Assembly of Single Chip Plated Ni/Pd over ALCAP Bond Pads for Flip Chip Applications and PrototypingBrian J. LewisDaniel F. BaldwinPaul N. HoustonLe hang LaTim Spark
- A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC StructuresKarthikeyan DhandapaniAhmer SyedWei LinMark NakamotoWei ZhaoRiko Radojcic
- Low Temperature Direct Aluminum Soldering PasteWilliam F. Avery
- Room Temperature Debonding - An Enabling Technology for TSV and 3D IntegrationThorsten MatthiasEric PaboJuergen BurggrafDaniel BurgstallerMarkus WimplingerPaul Lindner
- 3D Integration of RF PackageKai LiuYongTaek LeeHyunTai KimGwang KimBilly Ahn
- NCP (Non Conductive Paste) for Narrow Gap Flip Chip Package and TSV PackageHidenori AbeTomoya MasudaYuko KondoHiroshi Takahashi
- ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal PerformanceSenthil SivaswamyTheodore (Ted) G. TessierTony CurtisDavid ClarkKazuhisa ItoiMasahiro OkamotoYoshinori SanoNobuyuki UetaSatoshi OkudeOsamu Nakao
- Low-Cost Adhesives for Temporary Substrate SupportJohn MooreJared Pettit
- Low Temperature Wafer Level Bonding Using Benzocyclobutene Adhesive PolymersMichael GallagherJong-Uk KimEric HuengerKai ZoschkeChristina LopperMichael Toepper
- Predicting the Reliability of Zero-Level TSVsGreg CaswellCraig Hillman
- Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)Eric HuengerJoe LachowskiGreg ProkopowiczRay ThibaultMichael GallagherScott KistingLynne MillsMasaki Kondoh
- Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped DieGilbert LecarpentierJoeri De Vos
- Temporary Wafer Bonding Materials and ProcessesMatthew LueckAlan HuffmanMarianne ButlerDorota TemplePhil Garrou
- Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing PhenomenonD. Saint-PatriceJ. L. PorninB. SavorninG. RodriguezS. DanthonP. L. CharvetP. NicolasS. NicolasS. Fanget
- TSV Market Drivers, Demand & Product ReadinessRon Huemoeller
- MEMS Tornado to Challenge Next Generation PackagingJanusz Bryzek
- Ultra-Slim PackagesBernd K. Appelt
- Post-Packaged Measurement of MEMS Gap, Displacement, Force, Stiffness, Mass, Damping, and Quality FactorJason Vaughn Clark
- Laddered-UBM Structure: Bump Reliability Improvement through Distribution of Load Concentration PointsRoden Topacio
- 3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSVRao Tummala
- Study of Factors Which Influenced to Bump Shape and Voids in Bumps during Bump Formation with Solder PasteMasayuki IshikawaHironori UnoTakashi YamajiRyuji UesugiAkihiro MasudaShingo HiranoFuyumi MawatariNatsuko TanakaKohki Okada
- Studies and Applications of Advanced Laser Scribing for High Brightness LEDsIrving ChyrCheng PengJi WangJonathan Halderman
- TGV Microfabrication Technology for 3D PackagingShintaro TakahashiChristian SchmidtLeander DittmannSvend HoyerAdrien ChaizeMotoshi OnoKenji KitaokaKentaro TatsukoshiShoichi Konishi
- Wafer-Level Bonding using Anisotropic Conductive Adhesive for 3D MEMS ApplicationsLars G. W. TvedtNicolas LietaerThor BakkeKeith RedfordHelge Kristiansen
- 3D & System-in-Package Development with the Redistributed Chip Package (RCP)Zhiwei (Tony) GongScott HayesNavjot ChhabraTrung DuongDoug MitchellJason WrightMichael Vincent
- Assembly Challenges for Large Interposer 2.5D TSV ProductsMarnie MatteiMike Kelly
- Development of Substrates for Through Glass ViasAric ShoreyScott Pollard
- Passive Flexible-Substrate Blast Sensor ArrayStephen M. PhillipsDavid R. AlleeNarendra Lakamraju
- Ultra High 3D Capacitors Values with High Volume Efficiency and Outstanding StabilityCatherine BunelFranck Murray
- Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency ApplicationsTim MobleyVern Stygar
- Simulating Atomic-Scale Defects with Atomic Methods and Extended Finite ElementsJay Oswald
- Performance of MEMS Vibratory Gyroscope under Harsh EnvironmentsChandradip PatelPatrick McCluskey
- MEMS Based Transducer Designs for Monitoring High Speed ImpactsPhilip ReinerArthur JenkinsSharon SanchezTracy D. HudsonMichael Kranz
- Large Die Size Lead Free Flip Chip Ball Grid Array Packaging Considerations for 40nm Fab TechnologyMark A. BachmanJerry LiaoJohn OsenbachZafer KutluJaeyun GimDanny Brady
- High Density Attachment of HB-LED Die to Heat Sink Surfaces Using Aerosol Jet PrintingKurt K. ChristensonMichael J. RennJason A. PaulsenJustin J. BourassaKelley M. McDonald
- Plating Opportunities in 3DAlbrecht UhligHolger BeraCornelia JaegerDirk Rohde
- Testing of Flexible Metamaterial RF Filters Implemented through Micromachining LCP SubstratesRobert DeanJonathan Richard
- Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu SubstratesRussell StapletonJim Greig
- Flexible Electronics Fabrication for Missile Wiring InterconnectsMichael R. WhitleyTracy D. Hudson
- Modeling and Simulation of 3D MEMS Integrated RF CircuitsBruce KimSukeshwar KannanAnurag GuptaNaga Sai Evana
- Temperature Cycling Induced Warpage of Packages with Embedded Copper HeatspreadersMatthew StahleyJohn OsenbachBrenda GogueByong Il HeoByung Cheol LeeDongmei Meng
- The Reactive Bridge: A Novel Solid-State Low Energy InitiatorThomas A. BaginskiRobert N. Dean
- Hybrid Bonding Methods Using Ultra Precision Cutting for 3D-SICTaiji SakaiNobuhiro ImaizumiMasataka MizukoshiMasayuki KawaseRyoji TanimotoTakashi MoriKohei TakedaToshio Enami
- Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip StackingAnupam ChoubeyE. AnzuresA. DhobleD. FlemingM. GallagherI. LeeM. OliverY. QinC. TruongZ. WangJ. Woertink
- Gold Stud Bump on Sn Based SoldersTerence Q. Collier
- 3D Packaging Solution Providing DDR & LPDDR Co-Support for Ultrabooks and Next Generation ServersSimon McElreaVern Solberg
- Active and Passive Devices Embedded in Laminate-Based Multilayer BoardSatoshi OkudeKazushisa ItoiMasahiro OkamotoNobuki UetaOsamu Nakao
- Embedded Chip Technology: Technologies, Applications and Future DevelopmentsLars BoettcherS. KaraszkiewiczD. ManessisA. Ostmann
- Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging ApplicationsJeb FlemmingRoger CookKevin DunnJames Gouker
- Improvement of Plated Copper Adhesion in Glass Interposer ApplicationsSimon BambergVijay SukumaranVenky SundaramRao TummalaJohannes EtzkornFrank Brüning
- Super Fine Lead-Free Solder Powder for Fine Pitch Bump ApplicationsRyuji UesugiHironori UnoMasayuki IshikawaAkihiro MasudaHiroki MuraokaYousuke KawamuraSho NakagawaKanji Kuba
- Thermal Reliability for LED Lighting DesignJustin KolbeSanjay Misra
- Reduced Temperature Metal Based Bonding Processes for Wafer Level Packaging and 3D IntegrationEric F. PaboViorel DragoiTian TangThorsten Matthias
- Thermal Cycling Analysis of BGA Solder Joint ReliabilityBetty H. YeungTorsten HauckBrett WilkersonThomas Koschmieder
- Micromachined High Density Embedded Capacitor Technologies for Silicon InterposersAubrey BealT. BaginskiR. DeanM. Hamilton
- Silicon Interposer Creation Using Innovative Ultra-Thin Wafer Handling SolutionsAmandine JouveG. GarnierE. DezandreM. PellatK. VialS. CheramyJ-P. ColonnaR. Sandeacutegaud gaudN. SillonR. PuligaddaJ. McCutcheon
- Development of Electronic Substrates for Medical Device ApplicationsFrank D. EgittoRabindra N. DasFrancesco MarconiBill WilsonVoya R. Markovich
- Thermal Challenges in 3D StacksSusheela NarasimhanHerman ChuMudasir AhmadLi Li
- High-Aspect Ratio Planarization using Self-Leveling MaterialsMichelle FowlerDongshun BaiCurt PlanjeXie Shao
- The Evolution of LED Packaging: New Approaches for Solid State LightingRobert F. Karlicek
- 2.5D and 3D Packaging Enables Effective Multi-Chip PackagingPhil Marcoux
- Proven Cleaning Technology Solutions for Lead-Free Micro-Bumping ProcessesKimberly D. PollardNichelle GilbertDon PfettscherSpencer Hochstetler
- Low-Temperature Indium Bonding for MEMS DevicesDaniel HarrisRobert DeanAshish PalkarMike PalmerCharles EllisGary Wonacott
- Polymer-Based Hermetic Packaging for Flexible Micro DevicesLi-Anne LiewChing-Yi LinY. C. Lee
- Silicon Wafer Thinning to Reveal Cu TSVLaura MauerJohn TaddeiRamey Youssef
- In-Coated Carbon Nanotubes for Flexible InterconnectsPingye XuMichael C. Hamilton
- Laser Processing and Integration for Si Interposers and 3D Packaging ApplicationsMatthew KnowlesAndy HooperKip Pettigrew
- Development of Lead Free Plating Chemical for Various ApplicationsTakeshi HattaAtsushi IshikawaTakuma KataseAkihiro Masuda
- New Advances in 3D/2.5D IntegrationRobert Patti
- Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board ApplicationsRavi M. BhatkalRanjit PandherAnna LiftonPaul KoepHafez Raeisi Fard
Papanu, Victor. 2012. “Comparative Test Data for TIM Materials for LED Applications.” IMAPSource Proceedings 2012 (DPC): 655–83. https://doi.org/10.4071/2012DPC-ta41.