ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Hybrid Bonding Methods Using Ultra Precision Cutting for 3D-SIC
Hybrid Bonding Methods Using Ultra Precision Cutting for 3D-SIC
Taiji Sakai, Nobuhiro Imaizumi, Masataka Mizukoshi, Masayuki Kawase, Ryoji Tanimoto, Takashi Mori, Kohei Takeda, Toshio Enami,
Sakai, Taiji, Nobuhiro Imaizumi, Masataka Mizukoshi, Masayuki Kawase, Ryoji Tanimoto, Takashi Mori, Kohei Takeda, and Toshio Enami. 2012. “Hybrid Bonding Methods Using Ultra Precision Cutting for 3D-SIC.” IMAPSource Proceedings 2012 (DPC): 1701–30. https://doi.org/10.4071/2012DPC-wp12.