ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures
A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures
Karthikeyan Dhandapani, Ahmer Syed, Wei Lin, Mark Nakamoto, Wei Zhao, Riko Radojcic,
Dhandapani, Karthikeyan, Ahmer Syed, Wei Lin, Mark Nakamoto, Wei Zhao, and Riko Radojcic. 2012. “A Methodology for Chip - Package Interaction (CPI) Modeling in 3D IC Structures.” IMAPSource Proceedings 2012 (DPC): 1373–93. https://doi.org/10.4071/2012DPC-wa12.