ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon
Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon
D. Saint-Patrice, J. L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, P. L. Charvet, P. Nicolas, S. Nicolas, S. Fanget,
Saint-Patrice, D., J. L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, P. L. Charvet, P. Nicolas, S. Nicolas, and S. Fanget. 2012. “Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon.” IMAPSource Proceedings 2012 (DPC): 2428–82. https://doi.org/10.4071/2012DPC-tha31.