Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal Performance
ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal Performance
Senthil Sivaswamy, Theodore (Ted) G. Tessier, Tony Curtis, David Clark, Kazuhisa Itoi, Masahiro Okamoto, Yoshinori Sano, Nobuyuki Ueta, Satoshi Okude, Osamu Nakao,
Sivaswamy, Senthil, Theodore (Ted) G. Tessier, Tony Curtis, David Clark, Kazuhisa Itoi, Masahiro Okamoto, Yoshinori Sano, Nobuyuki Ueta, Satoshi Okude, and Osamu Nakao. 2012. “ChipletT, A Cost-Effective, High Reliability, Embedded Die Fan-Out Package Based on Multilayer Flex Laminate with Enhanced Thermal Performance.” IMAPSource Proceedings 2012 (DPC): 1–32. https://doi.org/10.4071/2012DPC-wa24.