ISSN 2380-4505
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency Applications
Through Glass Via (TGV) Solutions for Wafer and Chip level Interposers and RF Integration Methods for High Frequency Applications
Tim Mobley, Vern Stygar,
Mobley, Tim, and Vern Stygar. 2012. “Through Glass Via (TGV) Solutions for Wafer and Chip Level Interposers and RF Integration Methods for High Frequency Applications.” IMAPSource Proceedings 2012 (DPC): 1895–1919. https://doi.org/10.4071/2012DPC-wp25.