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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012January 01, 2012 EDT

Development of Substrates for Through Glass Vias

Aric Shorey, Scott Pollard,
glass interposer through glass via
• https://doi.org/10.4071/2012DPC-tp14
IMAPSource Conference Papers
Shorey, Aric, and Scott Pollard. 2012. “Development of Substrates for Through Glass Vias.” IMAPSource Proceedings 2012 (DPC): 832–45. https://doi.org/10.4071/2012DPC-tp14.
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