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Device Packaging Conference Presentations
Vol. 2012, Issue DPC, 2012
January 01, 2012 EDT
Development of Substrates for Through Glass Vias
Aric Shorey
,
Scott Pollard
,
glass
interposer
through glass via
•
https://doi.org/10.4071/2012DPC-tp14
IMAPSource Conference Papers
Shorey, Aric, and Scott Pollard. 2012. “Development of Substrates for Through Glass Vias.”
IMAPSource Proceedings
2012 (DPC): 832–45.
https://doi.org/10.4071/2012DPC-tp14
.
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