Vol. 2012, Issue DPC, 2012January 01, 2012 EDT
Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration
Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration
Thorsten Matthias, Eric Pabo, Juergen Burggraf, Daniel Burgstaller, Markus Wimplinger, Paul Lindner,
Matthias, Thorsten, Eric Pabo, Juergen Burggraf, Daniel Burgstaller, Markus Wimplinger, and Paul Lindner. 2012. “Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration.” IMAPSource Proceedings 2012 (DPC): 1755–82. https://doi.org/10.4071/2012DPC-wp14.