ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 05, 2026 EDT
The Glassomer Technology: A Novel Approach to Shaping Mankind’s Oldest Material
The Glassomer Technology: A Novel Approach to Shaping Mankind’s Oldest Material
Articles in Vol. 2025, Issue HiTEC, CICMT, Power, 2025
Vol. 2025, Issue HiTEC, CICMT, Power, 2025
- High Operational Temperature Sensors (HOTS)KK LawTodd Bauer
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power ModuleYujui LinCheng TangKewei XiaoMan Prakash GuptaMichael DegnerMehdi AsheghiKenneth GoodsonAlan Mantooth
- Heterogeneous Integration of Diamond Electronics: Transistors, Diodes, and PackagingAris Christou
- Survivability of AlGaN/GaN HEMTs made with WNx- and Pt-based Gate Metal Stacks above 500 oCNicholas SepelakMicheal J. HarringtonWeisong WangAkilesh SrikanthTimothy PrusnickStefan NikodemskiKevin LeedyBiddut SarkarKyle J. LiddyBranen BusseyAhsan MianAndrew GreenAhmad Islam
- High Temperature Inertial Navigation Sensors, Electronics, and Packaging for Reliable 300o C OperationRobert MacDonaldEmad AndarawisDavid ShaddockJeremy PoppDavid LinMelanie Schneider
- High Temperature Capable Multilevel Die Interconnect for 600°C operationEmad AndarawisMehrnegar AghayanRobert GossmanTammy JohnsonShubhodeep GoswamiCollin Hitchcock
- High Temperature High Pressure Cable for Subsurface InstrumentationAndrew Wright
- Solutions for Extreme Environments using XNodesPaul Minor
- Enabling Unconventional Geothermal Energy DevelopmentMatthew White
- Complex Permittivity Measurements of Substrates and Thin Films at Millimeter-wave FrequenciesLucas EnrightBryan BosworthNick JungwirthFlorian BergmannGeoff BrenneckaBenjamin JamrozNate Orloff
- Micro-Faraday Cage within Low-Temperature Co-fired Ceramic Board: Fabrication and MeasurementRoberto QuezadaEmmanuel DecrossasLatarence ButtsSamir El-GhazalyAlan Mantooth
- A Novel K7/K50 Co-Fireable PME LTCC Dielectric System for Microwave Filter ApplicationAnton PolotaiKeven ErskineJulie VoakMichael BrovaYi YangAmmar Kouki
- ECAM Technology for Power Electronic ModulesMichael MatthewsIan WinfieldNichole Romine
- Design of a GaN-Based High Current Low Voltage Two-Stage Converter with 3D Heterogeneous IntegrationSamuel Defaz
- Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic SystemsWhit VinsonDavid Huitink
- UV Imaging Electronics and Packaging for Venus MissionDavid ShaddockEmad AndarawisShubhodeep GoswamiGary HunterIke ChiIan HenryPhilip NeudeckMichael KrasowskiChristina AdamsDavid Spry
- Memory Phenomenon of GaN pn Junction by Engineering Its Interface, Which is Stable at High Temperatures up to 500oCKai Fu
- Lessons Learned to Transfer a K Band Radar System Designed on a Printed Circuit Board to a Low Temperature Co-Fired Ceramic BoardAlan MantoothEmmanuel DecrossasGarrett PetersonSamir El-Ghazaly
- Methods for Increasing Dimensional Stability of Buried Cavities in LTCC SubstratesJames Fraley
- Mitigation of Corrosion and Inter-Metallic Diffusion for SAC 305 Solder Paste on Silver/Palladium Ceramic Traces by Controlling Moisture ContentErick Spory
- Aluminum Oxynitride Films for Use in Power Electronics and Advanced PackagingJason SchmittBrian SollerMatthew D. HealyMahyar KhosraviHagen BartzschMatthias GittnerJorg Neidhardt
- The Glassomer Technology: A Novel Approach to Shaping Mankind's Oldest MaterialBastien E. Rapp
- High Temperature Substrate from 3D Glass SolutionsMatt Heidel
- An Update on High Temperature Passive Electronic Components and Emerging AEC Q200 TemperaturesDaniel West
- Temperature, Voltage, and Proximity Limitations in AlScN Non-Volatile Memory Devices for Extreme EnvironmentsDavid MooreNicholas GlavinJosh KennedyDhiren PradhanTroy OlssonDeep Jariwala
- Plasma Engineering of Materials for Power Electronics PackagingDaphne PappasRyan RobinsonTerry DunbarYaser HamediNico CoenenDhia Bensalem
- Examining Formic Acid Reflow in Power Device Packaging for Flux-Free SolderingDean Payne
- Assessing Thermal Buffering Half-Bridge Interconnects for Engine Compartment Traction InverterMichael Fish
- Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime TestingJeff Berlin
Rapp, Bastien E. 2026. “The Glassomer Technology: A Novel Approach to Shaping Mankind’s Oldest Material.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 246–68. https://doi.org/10.4071/001c.156287.