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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 04, 2026 EDT

ECAM Technology for Power Electronic Modules

Michael Matthews, Ian Winfield, Nichole Romine,
electrochemical additive manufacturing (ECAM)power electronic substratesthermal performancenext gen AI chip
https://doi.org/10.4071/001c.156240
IMAPSource Conference Papers
Matthews, Michael, Ian Winfield, and Nichole Romine. 2026. “ECAM Technology for Power Electronic Modules.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 623–41. https://doi.org/10.4071/001c.156240.

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