ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 05, 2026 EDT
Examining Formic Acid Reflow in Power Device Packaging for Flux-Free Soldering
Examining Formic Acid Reflow in Power Device Packaging for Flux-Free Soldering
Payne, Dean. 2026. “Examining Formic Acid Reflow in Power Device Packaging for Flux-Free Soldering.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 369–88. https://doi.org/10.4071/001c.156297.