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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 04, 2026 EDT

Memory Phenomenon of GaN pn Junction by Engineering Its Interface, Which is Stable at High Temperatures up to 500oC

Kai Fu,
high temperatureGaN resistive switchingmemory behavior
https://doi.org/10.4071/001c.156246
IMAPSource Conference Papers
Fu, Kai. 2026. “Memory Phenomenon of GaN Pn Junction by Engineering Its Interface, Which Is Stable at High Temperatures up to 500oC.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 114–54. https://doi.org/10.4071/001c.156246.

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