ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 04, 2026 EDT
Memory Phenomenon of GaN pn Junction by Engineering Its Interface, Which is Stable at High Temperatures up to 500oC
Memory Phenomenon of GaN pn Junction by Engineering Its Interface, Which is Stable at High Temperatures up to 500oC
Articles in Vol. 2025, Issue HiTEC, CICMT, Power, 2025
Vol. 2025, Issue HiTEC, CICMT, Power, 2025
- High Operational Temperature Sensors (HOTS)KK LawTodd Bauer
- DBC-based Embedded Micro-channel Cooler for the High-Power Density Power ModuleYujui LinCheng TangKewei XiaoMan Prakash GuptaMichael DegnerMehdi AsheghiKenneth GoodsonAlan Mantooth
- Heterogeneous Integration of Diamond Electronics: Transistors, Diodes, and PackagingAris Christou
- Survivability of AlGaN/GaN HEMTs made with WNx- and Pt-based Gate Metal Stacks above 500 oCNicholas SepelakMicheal J. HarringtonWeisong WangAkilesh SrikanthTimothy PrusnickStefan NikodemskiKevin LeedyBiddut SarkarKyle J. LiddyBranen BusseyAhsan MianAndrew GreenAhmad Islam
- High Temperature Inertial Navigation Sensors, Electronics, and Packaging for Reliable 300o C OperationRobert MacDonaldEmad AndarawisDavid ShaddockJeremy PoppDavid LinMelanie Schneider
- High Temperature Capable Multilevel Die Interconnect for 600°C operationEmad AndarawisMehrnegar AghayanRobert GossmanTammy JohnsonShubhodeep GoswamiCollin Hitchcock
- High Temperature High Pressure Cable for Subsurface InstrumentationAndrew Wright
- Solutions for Extreme Environments using XNodesPaul Minor
- Enabling Unconventional Geothermal Energy DevelopmentMatthew White
- Complex Permittivity Measurements of Substrates and Thin Films at Millimeter-wave FrequenciesLucas EnrightBryan BosworthNick JungwirthFlorian BergmannGeoff BrenneckaBenjamin JamrozNate Orloff
- Micro-Faraday Cage within Low-Temperature Co-fired Ceramic Board: Fabrication and MeasurementRoberto QuezadaEmmanuel DecrossasLatarence ButtsSamir El-GhazalyAlan Mantooth
- A Novel K7/K50 Co-Fireable PME LTCC Dielectric System for Microwave Filter ApplicationAnton PolotaiKeven ErskineJulie VoakMichael BrovaYi YangAmmar Kouki
- ECAM Technology for Power Electronic ModulesMichael MatthewsIan WinfieldNichole Romine
- Design of a GaN-Based High Current Low Voltage Two-Stage Converter with 3D Heterogeneous IntegrationSamuel Defaz
- Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic SystemsWhit VinsonDavid Huitink
- UV Imaging Electronics and Packaging for Venus MissionDavid ShaddockEmad AndarawisShubhodeep GoswamiGary HunterIke ChiIan HenryPhilip NeudeckMichael KrasowskiChristina AdamsDavid Spry
- Memory Phenomenon of GaN pn Junction by Engineering Its Interface, Which is Stable at High Temperatures up to 500oCKai Fu
- Lessons Learned to Transfer a K Band Radar System Designed on a Printed Circuit Board to a Low Temperature Co-Fired Ceramic BoardAlan MantoothEmmanuel DecrossasGarrett PetersonSamir El-Ghazaly
- Methods for Increasing Dimensional Stability of Buried Cavities in LTCC SubstratesJames Fraley
- Mitigation of Corrosion and Inter-Metallic Diffusion for SAC 305 Solder Paste on Silver/Palladium Ceramic Traces by Controlling Moisture ContentErick Spory
- Aluminum Oxynitride Films for Use in Power Electronics and Advanced PackagingJason SchmittBrian SollerMatthew D. HealyMahyar KhosraviHagen BartzschMatthias GittnerJorg Neidhardt
- The Glassomer Technology: A Novel Approach to Shaping Mankind's Oldest MaterialBastien E. Rapp
- High Temperature Substrate from 3D Glass SolutionsMatt Heidel
- An Update on High Temperature Passive Electronic Components and Emerging AEC Q200 TemperaturesDaniel West
- Temperature, Voltage, and Proximity Limitations in AlScN Non-Volatile Memory Devices for Extreme EnvironmentsDavid MooreNicholas GlavinJosh KennedyDhiren PradhanTroy OlssonDeep Jariwala
- Plasma Engineering of Materials for Power Electronics PackagingDaphne PappasRyan RobinsonTerry DunbarYaser HamediNico CoenenDhia Bensalem
- Examining Formic Acid Reflow in Power Device Packaging for Flux-Free SolderingDean Payne
- Assessing Thermal Buffering Half-Bridge Interconnects for Engine Compartment Traction InverterMichael Fish
- Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime TestingJeff Berlin
Fu, Kai. 2026. “Memory Phenomenon of GaN Pn Junction by Engineering Its Interface, Which Is Stable at High Temperatures up to 500oC.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 114–54. https://doi.org/10.4071/001c.156246.