Aluminum Oxynitride Films for Use in Power Electronics and Advanced Packaging

Jason Schmitt; Brian Soller; Matthew D. Healy; Mahyar Khosravi; Hagen Bartzsch; Matthias Gittner; Jorg Neidhardt

doi:10.4071/001c.156251

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Schmitt, Jason, Brian Soller, Matthew D. Healy, Mahyar Khosravi, Hagen Bartzsch, Matthias Gittner, and Jorg Neidhardt. 2026. “Aluminum Oxynitride Films for Use in Power Electronics and Advanced Packaging.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 223–45. https://doi.org/10.4071/001c.156251.

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