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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 04, 2026 EDT

Mitigation of Corrosion and Inter-Metallic Diffusion for SAC 305 Solder Paste on Silver/Palladium Ceramic Traces by Controlling Moisture Content

Erick Spory,
silver/palladium metal tracesceramic substratesmoisture control
https://doi.org/10.4071/001c.156250
IMAPSource Conference Papers
Spory, Erick. 2026. “Mitigation of Corrosion and Inter-Metallic Diffusion for SAC 305 Solder Paste on Silver/Palladium Ceramic Traces by Controlling Moisture Content.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 202–22. https://doi.org/10.4071/001c.156250.

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