ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 05, 2026 EDT
Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing
Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing
Berlin, Jeff. 2026. “Optimizing Power Electronics Reliability: Advanced Thermal Management & Wire Bond Lifetime Testing.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 412–46. https://doi.org/10.4071/001c.156305.