ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 04, 2026 EDT
Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems
Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems
Vinson, Whit, and David Huitink. 2026. “Considerations for Aluminum Wire Bonds in Next-Generation Power Electronic Systems.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 74–95. https://doi.org/10.4071/001c.156244.