ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 05, 2026 EDT
Plasma Engineering of Materials for Power Electronics Packaging
Plasma Engineering of Materials for Power Electronics Packaging
Pappas, Daphne, Ryan Robinson, Terry Dunbar, Yaser Hamedi, Nico Coenen, and Dhia Bensalem. 2026. “Plasma Engineering of Materials for Power Electronics Packaging.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 343–68. https://doi.org/10.4071/001c.156295.
