ISSN 2380-4505
Vol. 2025, Issue HiTEC, CICMT, Power, 2025February 03, 2026 EDT
High Temperature Capable Multilevel Die Interconnect for 600°C operation
High Temperature Capable Multilevel Die Interconnect for 600°C operation
Andarawis, Emad, Mehrnegar Aghayan, Robert Gossman, Tammy Johnson, Shubhodeep Goswami, and Collin Hitchcock. 2026. “High Temperature Capable Multilevel Die Interconnect for 600°C Operation.” IMAPSource Proceedings 2025 (HiTEC, CICMT, Power): 483–502. https://doi.org/10.4071/001c.156169.